2025-12-13 10.2.82.121
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Code of China
Chinese National Standard List: Printed circuit

GB/T 45723-2025 Test method for printed board—Monitoring of single plated-through hole(PTH) resistance change during temperature cycling 
  Issued on: 2025-05-30   Translation Price(USD): 210.0
GB/T 45714.54-2025 Printed circuit board materials—Part 5-4:Sectional specification set for conductive foils and films with or without coatings—Conductive pastes 
  Issued on: 2025-05-30   Translation Price(USD): 375.0
GB/T 45713.4-2025 Electronics assembly technology—Part 4: Endurance test methods for solder joint of area array type package surface mount devices 
  Issued on: 2025-05-30   Translation Price(USD): 645.0
GB/T 45660-2025 Electronics assembly technology—Electronic modules 
  Issued on: 2025-05-30   Translation Price(USD): 315.0
GB/T 33772.2-2025 Quality assessment systems —Part 2: Selection and use of sampling plans for inspection of electronic components and packages 
  Issued on: 2025-05-30   Translation Price(USD): 315.0
GB/T 19405.3-2025 Surface mounting technology—Part 3:Standard method for the specification of components for through hole reflow（THR）soldering 
  Issued on: 2025-04-25   Translation Price(USD): 375.0
JB 8202-1995 Multilayer Printed adhesive prepreg sheet 
  Issued on:   Translation Price(USD):
GB/T 44295-2024 Epoxide woven E-glass prepreg for multilayer printed boards 
  Issued on: 2024-8-23   Translation Price(USD): 435.0
GB/T 43863-2024 Format for LSI—Package—Board interoperable design 
  Issued on: 2024-4-25   Translation Price(USD): 3225.0
GB/T 43799-2024 Sectional specification for high density interconnect printed boards 
  Issued on: 2024-3-15   Translation Price(USD): 510.0
GB/T 43801-2024 Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency—Split post dielectric resonator method 
  Issued on: 2024-3-15   Translation Price(USD): 375.0
GB/T 19247.6-2024 Printed board assemblies—Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method 
  Issued on: 2024-3-15   Translation Price(USD): 570.0
GB/T 9491-2021 Flux for tin soldering 
  Issued on: 2021-12-31   Translation Price(USD): 435.0
GB/T 4721-2021 General rules for rigid copper clad laminates for printed circuits  
  Issued on: 2021-11-26   Translation Price(USD): 255.0
GB 4588.1-1984 Specification for single and double sided printed boards with plain holes 
  Issued on:   Translation Price(USD): 260.0
GB/T 14515-2019 Sectional specification for single and double sided flexible printed board  
  Issued on: 2019-03-25   Translation Price(USD): 630.0
GB/T 5489-2018 Printed circuit board draw 
  Issued on: 2018-09-17   Translation Price(USD): 250.0
GB/T 36476-2018 General specification for metal base copper-clad laminates for printed circuits 
  Issued on: 2018-06-07   Translation Price(USD): 430.0
GB/T 31988-2015 Aluminium base copper clad laminate for printed circuits 
  Issued on: 2015-09-11   Translation Price(USD): 370.0
GB 4588.2-1984 Specification for single and double sided printed boards with plated-through holes 
  Issued on:   Translation Price(USD): 375.0
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