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Chinese National Standard Category: Semiconductor discrete devices in general |
English Title: | Semiconductor devices—Mechanical and climatic test methods—Part 22:Bond strength |
Chinese Title: | 半导体器件 机械和气候试验方法 第22部分:键合强度 |
Standard No.: | GB/T 4937.22-2018 |
Category No.: | L40 |
Issued by: | SAMR; SAC |
Issued on: | 2018-09-17 |
Implemented on: | 2019-1-1 |
Status: | valid |
Superseded by: | |
Superseded on: | |
Abolished on: | |
Superseding: | |
Word Count: | 8500 words |
Similar Standards: | T/CIE 145-2022 T/CIE 116-2021 T/CIE 147-2022 T/CIE 119-2021 GB/T 4937.26-2023 GB/T 4587-2023 GB/T 42709.19-2023 GB/T 4937.42-2023 GB/T 4937.27-2023 GB/T 42709.7-2023 GB/T 4937.32-2023 GB/T 4937.31-2023 GB/T 4937.23-2023 GB/T 42706.5-2023 GB/T 42706.2-2023 GB/T 42709.5-2023 GB/T 4937.17-2018 GB/T 4937.30-2018 GB/T 4937.14-2018 GB/T 4937.15-2018 |
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