2025-12-14 10.2.82.121
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Code of China
Chinese National Standard List: Semiconductor discrete devices in general

GB/T 4937.16-2025 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection(PIND) 
  Issued on: 2025-10-31   Translation Price(USD): 270.0
GB/T 46567.1-2025 Intelligent computing - Test method for memristor - Part 1: Basic characteristics 
  Issued on: 2025-10-31   Translation Price(USD): 240.0
GB/T 45722-2025 Semiconductor devices—Constant current electromigration test 
  Issued on: 2025-05-30   Translation Price(USD): 270.0
GB/T 45721.1-2025 Semiconductor devices—Stress migration test—Part 1: Copper stress migration test 
  Issued on: 2025-05-30   Translation Price(USD): 435.0
GB/T 45718-2025 Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for inter-metal layers 
  Issued on: 2025-05-30   Translation Price(USD): 315.0
GB/T 45719-2025 Semiconductor devices—Hot carrier test on metal-oxide semiconductor(MOS) transistors 
  Issued on: 2025-05-30   Translation Price(USD): 270.0
GB/T 45716-2025 Semiconductor devices—Bias temperature instability test for metal-oxide semiconductor field-effect transistors (MOSFETs) 
  Issued on: 2025-05-30   Translation Price(USD): 270.0
DB32/T 4894-2024 Test method for performance of micro-electromechanical systems semiconductor gas sensor 
  Issued on: 2024-11-07   Translation Price(USD):
GB/T 4937.35-2024 Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components 
  Issued on: 2024-3-15   Translation Price(USD): 330.0
GB/T 4937.34-2024 Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling 
  Issued on: 2024-3-15   Translation Price(USD): 210.0
GB/T 4587-2023 Semiconductor devices—Discrete devices—Part 7:Bipolar transistors 
  Issued on: 2023-9-7   Translation Price(USD): 1275.0
GB/T 4937.26-2023 Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body model（HBM） 
  Issued on: 2023-9-7   Translation Price(USD): 800.0
GB/T 42709.19-2023 Semiconductor devices―Micro-electromechanical devices―Part 19:Electronic compasses 
  Issued on: 2023-08-06   Translation Price(USD): 435.0
GB/T 4937.27-2023 Semiconductor devices—Mechanical and climatic test methods—Part 27: Electrostatic discharge(ESD) sensitivity testing—Machine model(MM)  
  Issued on: 2023-05-23   Translation Price(USD): 255.0
GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life 
  Issued on: 2023-05-23   Translation Price(USD): 255.0
GB/T 4937.32-2023 Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices（externally induced）  
  Issued on: 2023-05-23   Translation Price(USD): 120.0
GB/T 4937.31-2023 Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices（internally induced）  
  Issued on: 2023-05-23   Translation Price(USD): 120.0
GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage 
  Issued on: 2023-05-23   Translation Price(USD): 180.0
GB/T 42709.7-2023 Semiconductor devices—Micro-electromechanical devices—Part 7: MEMS BAW filter and duplexer for radio frequency control and selection  
  Issued on: 2023-05-23   Translation Price(USD): 375.0
GB/T 42706.2-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 2：Deterioration mechanisms 
  Issued on: 2023-05-23   Translation Price(USD): 285.0
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