2025-12-17 10.9.52.83
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
Position: Search valid to be valid superseded to be superseded abolished to be abolished
Standard No. Title Price(USD) Delivery Status Add to Cart
GB/T 19520.6-2004 Mechanical structures for electronic equipemnt―Dimensions of mechanical structures of the 482.6mm(19in)series―Part 5-101:Subracks and associated plug-in nuits―Injector/extractor handle 120.0 via email in 1~3 business day superseded,2009-12-1,2005-2-1
GB/T 19520.10-2004 Mechanical structures for electronic equipment—Dimensions of mechanical structures of the 482.6mm (19in) series—Part 5-105:Subracks and associated plug-in units—Alignment and/or earth pin 130.0 via email in 1~3 business day superseded,2009-12-1,2005-2-1
QJ 548A-2004 General technical requirements for part manufacture and mechanical assembling of electronics 240.0 via email in 1~3 business day valid,,2004-12-1
SJ 52438/14-2004 Hybrid integrated circuits detail specification for type HPA501J power amplifiers 100.0 via email in 1~3 business day valid,,2004-12-1
SJ 50597/60-2004 Semiconductor integrated circuits Detail specification for types JW117/JW150/JW138 three terminal adjustable positive voltage reference 370.0 via email in 1~3 business day valid,,2004-12-1
QJ A 548-2004 General Technical Requirements for Part Manufacture and Mechanical Assembling of Electronics 180.0 via email in 1~3 business day valid,,2004-12-1
GB/T 15651.3-2003 Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods 370.0 via email in 1~3 business day valid,,2004-8-1
GB/T 19403.1-2003 Semiconductor devices—Integrated Circuits—Part 11:Section 1:Internal visual examination for semiconductor integrated circuits (excluding hybrid circuits) 300.0 via email in 1~3 business day valid,,2004-8-1
GB/T 17574.10-2003 Semiconductor devices—Integrated circuits—Part 2-10:Digital integrated circuits—Blank detail specification of integrated circuit dynamic read/write memories 190.0 via email in 1~3 business day valid,,2004-8-1
GB/T 19405.2-2003 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices(SMD) - Application guide 45.0 via email in 1~3 business day valid,,2004-8-1
GB/T 19405.1-2003 Surface mounting technology--Part 1:Standard method for the specification of surface mounting components(SMDs) 250.0 via email in 1~3 business day valid,,2004-8-1
GB/T 15651.2-2003 Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics 220.0 via email in 1~3 business day valid,,2004-8-1
GB/T 19247.3-2003 Printed board assemblies - Part 3: Sectional specification - Requirements for through - Hole mount soldered assemblies 130.0 via email in 1~3 business day valid,,2004-8-1
GB/T 19247.4-2003 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies 150.0 via email in 1~3 business day valid,,2004-8-1
GB/T 19290.1-2003 Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic STANDARD 210.0 via email in 1~3 business day valid,,2004-5-1
GB/T 3047.5-2003 Series of basic dimensions of cabiners for vertical increment of 20 mm 95.0 via email in 1~3 business day valid,,2004-5-1
GB/T 19290.2-2003 Modular order for the development of mechanical structures for electronic equipment practices—Part 2:Sectional specification—Interface co-ordination dimensions for the 25 mm equipment practice 150.0 via email in 1~3 business day valid,,2004-5-1
GB/T 3047.3-2003 Series of basic dimensions of subracks and plug-in units for vertical increment of 20 mm 60.0 via email in 1~3 business day valid,,2004-5-1
SJ 50734/9-2003 Style KX105 switches rotary detail specification for 100.0 via email in 1~3 business day valid,,2004-3-1
SJ 20868-2003 Measuring methods for charge coupled imaging device 340.0 via email in 1~3 business day valid,,2004-3-1
Previous Page     Next Page



Code of China
Search

GB/T 19520.6-2004 Mechanical structures for electronic equipemnt―Dimensions of mechanical structures of the 482.6mm(19in)series―Part 5-101:Subracks and associated plug-in nuits―Injector/extractor handle 
  Issued on: 2004-05-14   Price(USD): 120.0
GB/T 19520.10-2004 Mechanical structures for electronic equipment—Dimensions of mechanical structures of the 482.6mm (19in) series—Part 5-105:Subracks and associated plug-in units—Alignment and/or earth pin 
  Issued on: 2004-05-14   Price(USD): 130.0
QJ 548A-2004 General technical requirements for part manufacture and mechanical assembling of electronics 
  Issued on: 2004-9-1   Price(USD): 240.0
SJ 52438/14-2004 Hybrid integrated circuits detail specification for type HPA501J power amplifiers 
  Issued on: 2004-8-2   Price(USD): 100.0
SJ 50597/60-2004 Semiconductor integrated circuits Detail specification for types JW117/JW150/JW138 three terminal adjustable positive voltage reference 
  Issued on: 2004-8-2   Price(USD): 370.0
QJ A 548-2004 General Technical Requirements for Part Manufacture and Mechanical Assembling of Electronics 
  Issued on:   Price(USD): 180.0
GB/T 15651.3-2003 Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods 
  Issued on: 2003-1-1   Price(USD): 370.0
GB/T 19403.1-2003 Semiconductor devices—Integrated Circuits—Part 11:Section 1:Internal visual examination for semiconductor integrated circuits (excluding hybrid circuits) 
  Issued on: 2003-11-24   Price(USD): 300.0
GB/T 17574.10-2003 Semiconductor devices—Integrated circuits—Part 2-10:Digital integrated circuits—Blank detail specification of integrated circuit dynamic read/write memories 
  Issued on: 2003-01-01   Price(USD): 190.0
GB/T 19405.2-2003 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices(SMD) - Application guide 
  Issued on: 2003-11-24   Price(USD): 45.0
GB/T 19405.1-2003 Surface mounting technology--Part 1:Standard method for the specification of surface mounting components(SMDs) 
  Issued on: 2003-01-01   Price(USD): 250.0
GB/T 15651.2-2003 Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics 
  Issued on: 2003-1-1   Price(USD): 220.0
GB/T 19247.3-2003 Printed board assemblies - Part 3: Sectional specification - Requirements for through - Hole mount soldered assemblies 
  Issued on: 2003-11-24   Price(USD): 130.0
GB/T 19247.4-2003 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies 
  Issued on: 2003-11-24   Price(USD): 150.0
GB/T 19290.1-2003 Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic STANDARD 
  Issued on: 2003-9-15   Price(USD): 210.0
GB/T 3047.5-2003 Series of basic dimensions of cabiners for vertical increment of 20 mm  
  Issued on: 2003-9-1   Price(USD): 95.0
GB/T 19290.2-2003 Modular order for the development of mechanical structures for electronic equipment practices—Part 2:Sectional specification—Interface co-ordination dimensions for the 25 mm equipment practice 
  Issued on: 2003-09-15   Price(USD): 150.0
GB/T 3047.3-2003 Series of basic dimensions of subracks and plug-in units for vertical increment of 20 mm 
  Issued on: 2003-9-15   Price(USD): 60.0
SJ 50734/9-2003 Style KX105 switches rotary detail specification for 
  Issued on: 2003-12-25   Price(USD): 100.0
SJ 20868-2003 Measuring methods for charge coupled imaging device 
  Issued on: 2003-12-25   Price(USD): 340.0
About Us   |    Contact Us   |    Terms of Service   |    Privacy   |    Cancellation & Refund Policy   |    Payment
Tel: +86-10-8572 5655 | Fax: +86-10-8581 9515 | Email: coc@codeofchina.com | QQ: 672269886
Copyright: Beijing COC Tech Co., Ltd. 2008-2040