2025-12-17 10.1.14.108
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
Position: Search valid to be valid superseded to be superseded abolished to be abolished
Standard No. Title Price(USD) Delivery Status Add to Cart
GB/T 15157.12-2011 Connectors for frequencies below 3 MHz for use with printed boards—Part 12:Detail specification for dimensions,general requirements and tests for a range of sockets designed for use with integrated circuits 380.0 via email in 1~5 business day valid,,2012-7-1
GB/T 28277-2012 Silicon-based MEMS fabrication technology—Measurement method of cutting and pull-press strength of micro bonding area 330.0 via email in 1~3 business day valid,,2012-12-1
JB/T 9489-1999 Measuring mathod of major parameter for argon ion lasers 380.0 via email in 1~3 business day abolished2017-05-12 ,,2001-1-1
GB/T 13062-1991 Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure 120.0 via email in 1~3 business day superseded2019-07-01,2019-7-1,1992-3-1
SJ/T 10741-2000 Semiconductor integrated circuits General principles of measuring methods for CMOS circuits 1464.0 via email in 1~5 business day abolished2011-08-15 ,,2001-3-1
SJ 20384-2007 Specification for front locking device-type A of avionics cases 250.0 via email in 1~3 business day valid,,2007-12-1
GB/T 20296-2012 Mnemonics and symbols for integrated circuits 450.0 via email in 1~3 business day valid,,2013-7-1
GB/T 18904.1-2002 Semiconductor devices - Part 12-1: Optoelectronic devices-Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub 150.0 via email in 1~3 business day valid,,2003-5-1
GB/T 13420-1998 Electromechanical switches for use in electronic equipment Part 6: Sectional specification for sensitive switches Section 1: Blank 1: Blank detail specification 150.0 via email in 1~3 business day abolished2024-03-28,,1999-5-1
GB/T 14129-1993 and products for TTL semiconductor integrated circuits－Products of series PAL 370.0 via email in 1~3 business day valid,,1993-8-1
GB/T 18490-2001 Laser processing machines--Safety requirements 100.0 via email in 1 business day superseded2018-07-01,2018-7-1,2002-6-1
QJ 2462-1993 285.0 via email in 1~3 business day valid,,1991-6-10
GB/T 32816-2016 Silicon-based MEMS manufacturing technology to deep etch and bonding as the core of the process integration specification 250.0 via email in 1~3 business day valid,,2017-3-1
SJ 50597/63-2006 Semiconductor integrated circuits detail specification for types JF124 and JF124A quad operational amplifiers 330.0 via email in 1~3 business day valid,,2006-12-30
GB/T 11497.2-1989 Series and products for CMOS semiconductor integrated circuits--Products of series 54/74HCT 1874.0 via email in 1~5 business day abolished2005-10-14 ,,1990-4-1
GB 11297.5-1989 Test method for continuous lasing threshold, slope efficiency and output power of Nd: YAG laser rods 30.0 via email in 1~3 business day superseded2012-05-01 ,2012-5-1,1990-1-1
GB/T 8582-2008 Terminology for mechanical structures of electrotechnical and electronic equipment 370.0 via email in 1~3 business day valid,,2009-4-1
GB/T 31842-2015 Mechanical structures for electrotechnical and electronic equipment―Guide for design of environmental protection 430.0 via email in 1~5 business day valid,,2016-2-1
GB/T 17940-2000 Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits 1420.0 via email in 1~3 business day valid,,2000-8-1
GB/T 22764.4-2008 Cabinets for low-voltage switchgear—Part 4:Electrical safety requirements 100.0 via email in 1 business day valid,,2009-10-1
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GB/T 15157.12-2011 Connectors for frequencies below 3 MHz for use with printed boards—Part 12:Detail specification for dimensions,general requirements and tests for a range of sockets designed for use with integrated circuits 
  Issued on: 2011-12-30   Price(USD): 380.0
GB/T 28277-2012 Silicon-based MEMS fabrication technology—Measurement method of cutting and pull-press strength of micro bonding area 
  Issued on: 2012-5-11   Price(USD): 330.0
JB/T 9489-1999 Measuring mathod of major parameter for argon ion lasers 
  Issued on: 1999-08-06   Price(USD): 380.0
GB/T 13062-1991 Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure 
  Issued on: 1991-7-6   Price(USD): 120.0
SJ/T 10741-2000 Semiconductor integrated circuits General principles of measuring methods for CMOS circuits 
  Issued on: 2000-12-28   Price(USD): 1464.0
SJ 20384-2007 Specification for front locking device-type A of avionics cases 
  Issued on: 2007-07-14   Price(USD): 250.0
GB/T 20296-2012 Mnemonics and symbols for integrated circuits 
  Issued on: 2012-12-31   Price(USD): 450.0
GB/T 18904.1-2002 Semiconductor devices - Part 12-1: Optoelectronic devices-Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub  
  Issued on: 2002-12-1   Price(USD): 150.0
GB/T 13420-1998 Electromechanical switches for use in electronic equipment Part 6: Sectional specification for sensitive switches Section 1: Blank 1: Blank detail specification 
  Issued on: 1998-1-1   Price(USD): 150.0
GB/T 14129-1993 and products for TTL semiconductor integrated circuits－Products of series PAL 
  Issued on: 1993-2-3   Price(USD): 370.0
GB/T 18490-2001 Laser processing machines--Safety requirements 
  Issued on: 2001-1-1   Price(USD): 100.0
QJ 2462-1993  
  Issued on: 1993-03-20   Price(USD): 285.0
GB/T 32816-2016 Silicon-based MEMS manufacturing technology to deep etch and bonding as the core of the process integration specification 
  Issued on: 2016-08-29   Price(USD): 250.0
SJ 50597/63-2006 Semiconductor integrated circuits detail specification for types JF124 and JF124A quad operational amplifiers 
  Issued on: 2006-8-7   Price(USD): 330.0
GB/T 11497.2-1989 Series and products for CMOS semiconductor integrated circuits--Products of series 54/74HCT 
  Issued on: 1989-03-18   Price(USD): 1874.0
GB 11297.5-1989 Test method for continuous lasing threshold, slope efficiency and output power of Nd: YAG laser rods 
  Issued on: 1988-10-9   Price(USD): 30.0
GB/T 8582-2008 Terminology for mechanical structures of electrotechnical and electronic equipment  
  Issued on: 2008-6-19   Price(USD): 370.0
GB/T 31842-2015 Mechanical structures for electrotechnical and electronic equipment―Guide for design of environmental protection 
  Issued on: 2015-07-03   Price(USD): 430.0
GB/T 17940-2000 Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits 
  Issued on: 2000-01-03   Price(USD): 1420.0
GB/T 22764.4-2008 Cabinets for low-voltage switchgear—Part 4:Electrical safety requirements 
  Issued on: 2008-12-30   Price(USD): 100.0
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