GB/T 19922-2005 English Version, GB/T 19922-2005 Standard test methods for measuring site flatness on silicon wafers by noncontact scanning (English Version)

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GB/T 19922-2005 Standard test methods for measuring site flatness on silicon wafers by noncontact scanning (English Version)
Standard No.:	GB/T 19922-2005	Status:	valid remind me the status change Email:
Target Language:	English	File Format:	PDF
Word Count:	5000 words	Translation Price(USD):	150.0 remind me the price change Email:
Implemented on:	2006-4-1	Delivery:	via email in 1~3 business day

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Standard No.:	GB/T 19922-2005
English Name:	Standard test methods for measuring site flatness on silicon wafers by noncontact scanning
Chinese Name:	硅片局部平整度非接触式标准测试方法
Chinese Classification:	H17 Semimetal and semiconductor material analysis method
Professional Classification:	GB National Standard
ICS Classification:	77.040.01 77.040.01 Testing of metals in general 77.040.01
Source Content Issued by:	AQSIQ;SAC
Issued on:	2005-9-19
Implemented on:	2006-4-1
Status:	valid
Target Language:	English
File Format:	PDF
Word Count:	5000 words
Translation Price(USD):	150.0
Delivery:	via email in 1~3 business day

Standard

GB/T 19922-2005 Standard test methods for measuring site flatness on silicon wafers by noncontact scanning (English Version)
Standard No.	GB/T 19922-2005
Status	valid
Language	English
File Format	PDF
Word Count	5000 words
Price(USD)	150.0
Implemented on	2006-4-1
Delivery	via email in 1~3 business day

Detail of GB/T 19922-2005

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Introduction of GB/T 19922-2005

本标准规定了用电容位移传感法测定硅片表面局部平整度的方法。本标准适用于无接触、非破坏性地测量干燥、洁净的半导体硅片表面的局部平整度。适用于直径100mm及以上、厚度250μm及以上腐蚀、抛光及外延硅片。

Contents of GB/T 19922-2005

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