JB/T 6175-2020 English Version, JB/T 6175-2020 The lead forming process specifcation for the electronic componcnts (English Version)

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JB/T 6175-2020 The lead forming process specifcation for the electronic componcnts (English Version)
Standard No.:	JB/T 6175-2020	Status:	valid remind me the status change Email:
Target Language:	English	File Format:	PDF
Word Count:	9500 words	Translation Price(USD):	285.0 remind me the price change Email:
Implemented on:	2021-4-1	Delivery:	via email in 1~3 business day

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Standard No.:	JB/T 6175-2020
English Name:	The lead forming process specifcation for the electronic componcnts
Chinese Name:	电子元器件引线成型工艺规范
Professional Classification:	JB Professional Standard - Machinery
Source Content Issued by:	MIIT
Issued on:	2020-12-9
Implemented on:	2021-4-1
Status:	valid
Superseding:	JB/T 6175-1992 Process Specification for Forming of Instrumentation Electronic Component Lead Wire
Target Language:	English
File Format:	PDF
Word Count:	9500 words
Translation Price(USD):	285.0
Delivery:	via email in 1~3 business day

Standard

JB/T 6175-2020 The lead forming process specifcation for the electronic componcnts (English Version)
Standard No.	JB/T 6175-2020
Status	valid
Language	English
File Format	PDF
Word Count	9500 words
Price(USD)	285.0
Implemented on	2021-4-1
Delivery	via email in 1~3 business day

Detail of JB/T 6175-2020

Standard No.

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Chinese Classification

Professional Classification

ICS Classification

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Superseded on

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Superseding

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Keywords

Introduction of JB/T 6175-2020

本标准规定了电子元器件（不包括集成电路的电子元器件）引线成型工艺的术语及定义、目的、环境条件及元器件引线成型前期准备、成型技术参数要求、元器件引线成型要求、引线成型的操作、元器件成型后的检验。
本标准适用于元器件的引线成型。

Contents of JB/T 6175-2020

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