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| Position: Chinese Standard in English/SJ/T 12021-2025 |
| SJ/T 12021-2025 Epoxy potting adhesive for power semiconductor modules (English Version) | |||
| Standard No.: | SJ/T 12021-2025 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 6500 words | Translation Price(USD): | 195.0 remind me the price change |
| Implemented on: | Delivery: | via email in 1~3 business day | |
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| Standard No.: | SJ/T 12021-2025 |
| English Name: | Epoxy potting adhesive for power semiconductor modules |
| Chinese Name: | 功率半导体模块用环氧灌封胶 |
| Professional Classification: | SJ Professional Standard - Electronics |
| Issued on: | 2025-05-12 |
| Status: | valid |
| Target Language: | English |
| File Format: | |
| Word Count: | 6500 words |
| Translation Price(USD): | 195.0 |
| Delivery: | via email in 1~3 business day |