2025-12-17 216.73.216.89
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
Position: Search valid to be valid superseded to be superseded abolished to be abolished
Standard No. Title Price(USD) Delivery Status Add to Cart
GB/T 16595-1996 Specification for a universal wafer grid 234.0 via email in 1~3 business day superseded,2020-2-1,1997-4-1
GB/T 12964-1996 Monocrystalline silicon polished wafers 130.0 via email in 1~3 business day superseded2004-01-01,2004-1-1,1997-4-1
GB/T 16596-1996 Specification for establishing a wafer coordinate system 75.0 via email in 1~3 business day superseded,2020-2-1,1997-4-1
GB/T 12962-1996 Monocrystalline silicon 120.0 via email in 1~3 business day superseded2006-04-01,2006-4-1,1997-4-1
YS/T 223-1996 Selenium 105.0 via email in 1~3 business day superseded,2008-5-1,1996-12-1
YS/T 224-1994 Thallium 30.0 via email in 1~3 business day superseded,2017-1-1,1993-3-1
YS/T 43-1992 High-purity arsenic 184.0 via email in 1~3 business day superseded,2012-7-1,1993-3-1
YS/T 222-1996 Tellurium ingots 105.0 via email in 1~3 business day superseded,2011-3-1,1993-3-1
YS/T 23-1992 Thickness determination for silicon epitaxial layers - Stacking fault method 60.0 via email in 1~3 business day superseded,2016-9-1,1993-1-1
YS/T 24-1992 Test method for defects of extended nails 30.0 via email in 1~3 business day superseded,2016-9-1,1993-1-1
YS/T 28-1992 Silicon wafer packaging 184.0 via email in 1~3 business day superseded,2015-10-1,1993-1-1
YS/T 26-1992 Test method for silicon wafer edge 60.0 via email in 1~3 business day superseded,2017-1-1,1993-1-1
YS/T 15-1991 Thcikness determination for silicon epitaxial layer and difussion layer - Angle lap-stain method 90.0 via email in 1~3 business day superseded,2015-10-1,1992-6-1
T/CEMIA 023-2021 Quartz crucible for semiconductor monosilicon growth 225.0 via email in 1~3 business day valid,,
T/CEMIA 024-2021 Quartz crucible manufacturing practices for semiconductor monosilicon growth 165.0 via email in 1~3 business day valid,,
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GB/T 16595-1996 Specification for a universal wafer grid 
  Issued on: 1996-1-1   Price(USD): 234.0
GB/T 12964-1996 Monocrystalline silicon polished wafers 
  Issued on: 1996-11-04   Price(USD): 130.0
GB/T 16596-1996 Specification for establishing a wafer coordinate system 
  Issued on: 1996-1-1   Price(USD): 75.0
GB/T 12962-1996 Monocrystalline silicon 
  Issued on: 1996-01-01   Price(USD): 120.0
YS/T 223-1996 Selenium 
  Issued on: 1996-02-02   Price(USD): 105.0
YS/T 224-1994 Thallium 
  Issued on: 1982-3-1   Price(USD): 30.0
YS/T 43-1992 High-purity arsenic 
  Issued on: 1992-03-19   Price(USD): 184.0
YS/T 222-1996 Tellurium ingots 
  Issued on: 1994-01-01   Price(USD): 105.0
YS/T 23-1992 Thickness determination for silicon epitaxial layers - Stacking fault method 
  Issued on: 1992-3-9   Price(USD): 60.0
YS/T 24-1992 Test method for defects of extended nails 
  Issued on: 1992-3-9   Price(USD): 30.0
YS/T 28-1992 Silicon wafer packaging 
  Issued on: 1992-3-9   Price(USD): 184.0
YS/T 26-1992 Test method for silicon wafer edge 
  Issued on: 1992-3-9   Price(USD): 60.0
YS/T 15-1991 Thcikness determination for silicon epitaxial layer and difussion layer - Angle lap-stain method 
  Issued on:   Price(USD): 90.0
T/CEMIA 023-2021 Quartz crucible for semiconductor monosilicon growth 
  Issued on: 2021-07-15   Price(USD): 225.0
T/CEMIA 024-2021 Quartz crucible manufacturing practices for semiconductor monosilicon growth 
  Issued on: 2021-07-15   Price(USD): 165.0
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