2025-12-14 216.73.216.3
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Code of China
Chinese National Standard List: Microcircuit in general

GB/T 42706.4-2025 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage 
  Issued on: 2025-10-31   Translation Price(USD): 315.0
GB/T 46280.5-2025 Specification for chiplet interconnection interface - Part 5: Physical layer technical requirements based on 2.5D package 
  Issued on: 2025-8-19   Translation Price(USD): 600.0
GB/T 45720-2025 Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for gate dielectric films 
  Issued on: 2025-05-30   Translation Price(USD): 375.0
GB/T 44796-2024 Integrated circuit 3D packaging—Requirement for bumping-wafer-sawing process and evaluation 
  Issued on: 2024-10-26   Translation Price(USD): 225.0
GB/T 44791-2024 Integrated circuit 3D packaging—Requirement for bumping-wafer-thining process and evaluation 
  Issued on: 2024-10-26   Translation Price(USD): 270.0
GB/T 44775-2024 Integrated circuit 3D packaging— Requirement for die stack process and evaluation 
  Issued on: 2024-10-26   Translation Price(USD): 375.0
GB/T 43931-2024 General specification for microwave integrated circuit chip for aerospace 
  Issued on: 2024-06-29   Translation Price(USD): 435.0
DB34/T 3939-2021 General test methods for servo circuits of quartz flexible accelerometers for space applications 
  Issued on: 2021-06-08   Translation Price(USD): 315.0
GB/T 43940-2024 4 Mb/s digital time division command/response multiplex data bus test plan 
  Issued on: 2024-4-25   Translation Price(USD): 900.0
GB/T 43939-2024 General test methods for servo circuits of quartz flexible accelerometers for space applications 
  Issued on: 2024-4-25   Translation Price(USD): 315.0
GB/T 43538-2023 Quality and technical requirements for metal packages used for integrated circuits 
  Issued on: 2023-12-28   Translation Price(USD): 495.0
GB/T 43536.1-2023 Three dimensional integrated circuit—Part 1：Terminologies and definitions 
  Issued on: 2023-12-28   Translation Price(USD): 260.0
GB/Z 43510-2023 Integrated circuit TSV 3D package reliability test methods guideline 
  Issued on: 2023-12-28   Translation Price(USD): 165.0
GB/T 43063-2023 Integrated circuit—Test method for CMOS image sensors 
  Issued on: 2023-9-7   Translation Price(USD): 600.0
GB/T 43027-2023 Measuring methods of converter modules for high voltage input power supplie 
  Issued on: 2023-9-7   Translation Price(USD): 1000.0
GB/T 42972-2023 Microwave circuits—Test methods for detector 
  Issued on: 2023-9-7   Translation Price(USD): 400.0
GB/T 43040-2023 Semiconductor integrated circuits—Test method of AC/DC converters  
  Issued on: 2023-09-07   Translation Price(USD): 700.0
GB/T 43061-2023 Semiconductor integrated circuits—Test methods of PWM controller  
  Issued on: 2023-09-07   Translation Price(USD): 1000.0
GB/T 15879.604-2023 Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA) 
  Issued on: 2023-05-23   Translation Price(USD): 285.0
GB/T 42706.1-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 1：General 
  Issued on: 2023-05-23   Translation Price(USD): 465.0
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