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| Position: Chinese Standard in English/GB/T 15879.604-2023 |
| GB/T 15879.604-2023 Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA) (English Version) | |||
| Standard No.: | GB/T 15879.604-2023 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 9500 words | Translation Price(USD): | 285.0 remind me the price change |
| Implemented on: | 2023-9-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | GB/T 15879.604-2023 |
| English Name: | Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA) |
| Chinese Name: | 半导体器件的机械标准化 第6-4部分：表面安装半导体器件封装外形图绘制的一般规则 焊球阵列（BGA）封装的尺寸测量方法 |
| Chinese Classification: | L55 Microcircuit in general |
| Professional Classification: | GB National Standard |
| Source Content Issued by: | SAMR; SAC |
| Issued on: | 2023-05-23 |
| Implemented on: | 2023-9-1 |
| Status: | valid |
| Target Language: | English |
| File Format: | |
| Word Count: | 9500 words |
| Translation Price(USD): | 285.0 |
| Delivery: | via email in 1~3 business day |