2025-12-5 216.73.216.21
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
Position: Search valid to be valid superseded to be superseded abolished to be abolished
Standard No. Title Price(USD) Delivery Status Add to Cart
GB/T 46280.5-2025 Specification for chiplet interconnection interface - Part 5: Physical layer technical requirements based on 2.5D package 600.0 via email in 1~8 business day to be valid,,2026-3-1
GB/T 45720-2025 Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for gate dielectric films 375.0 via email in 1~5 business day valid,,2025-9-1
GB/T 44796-2024 Integrated circuit 3D packaging—Requirement for bumping-wafer-sawing process and evaluation 225.0 via email in 1~3 business day valid,,2025-5-1
GB/T 44791-2024 Integrated circuit 3D packaging—Requirement for bumping-wafer-thining process and evaluation 270.0 via email in 1~3 business day valid,,2025-5-1
GB/T 44775-2024 Integrated circuit 3D packaging— Requirement for die stack process and evaluation 375.0 via email in 1~5 business day valid,,2025-5-1
GB/T 43931-2024 General specification for microwave integrated circuit chip for aerospace 435.0 via email in 1~5 business day valid,,2024-10-1
GB/T 43940-2024 4 Mb/s digital time division command/response multiplex data bus test plan 900.0 via email in 1~5 business day valid,,2024-8-1
GB/T 43939-2024 General test methods for servo circuits of quartz flexible accelerometers for space applications 315.0 via email in 1~5 business day valid,,2024-8-1
GB/T 43538-2023 Quality and technical requirements for metal packages used for integrated circuits 495.0 via email in 1~5 business day valid,,2024-7-1
GB/T 43536.1-2023 Three dimensional integrated circuit—Part 1：Terminologies and definitions 260.0 via email in 1~3 business day valid,,2024-4-1
GB/Z 43510-2023 Integrated circuit TSV 3D package reliability test methods guideline 165.0 via email in 1~3 business day valid,,2024-4-1
GB/T 43040-2023 Semiconductor integrated circuits—Test method of AC/DC converters 700.0 via email in 1~5 business day valid,,2024-4-1
GB/T 43061-2023 Semiconductor integrated circuits—Test methods of PWM controller 1000.0 via email in 1~5 business day valid,,2024-4-1
GB/T 43063-2023 Integrated circuit—Test method for CMOS image sensors 600.0 via email in 1~5 business day valid,,2024-1-1
GB/T 43027-2023 Measuring methods of converter modules for high voltage input power supplie 1000.0 via email in 1~5 business day valid,,2024-1-1
GB/T 42972-2023 Microwave circuits—Test methods for detector 400.0 via email in 1~5 business day valid,,2024-1-1
GB/T 15879.604-2023 Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA) 285.0 via email in 1~3 business day valid,,2023-9-1
GB/T 42706.1-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 1：General 465.0 via email in 1~5 business day valid,,2023-9-1
GB/T 41852-2022 Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures 225.0 via email in 1~3 business day valid,,2022-10-12
GB/T 41853-2022 Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement 315.0 via email in 1~5 business day valid,,2022-10-12
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GB/T 46280.5-2025 Specification for chiplet interconnection interface - Part 5: Physical layer technical requirements based on 2.5D package 
  Issued on: 2025-8-19   Price(USD): 600.0
GB/T 45720-2025 Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for gate dielectric films 
  Issued on: 2025-05-30   Price(USD): 375.0
GB/T 44796-2024 Integrated circuit 3D packaging—Requirement for bumping-wafer-sawing process and evaluation 
  Issued on: 2024-10-26   Price(USD): 225.0
GB/T 44791-2024 Integrated circuit 3D packaging—Requirement for bumping-wafer-thining process and evaluation 
  Issued on: 2024-10-26   Price(USD): 270.0
GB/T 44775-2024 Integrated circuit 3D packaging— Requirement for die stack process and evaluation 
  Issued on: 2024-10-26   Price(USD): 375.0
GB/T 43931-2024 General specification for microwave integrated circuit chip for aerospace 
  Issued on: 2024-06-29   Price(USD): 435.0
GB/T 43940-2024 4 Mb/s digital time division command/response multiplex data bus test plan 
  Issued on: 2024-4-25   Price(USD): 900.0
GB/T 43939-2024 General test methods for servo circuits of quartz flexible accelerometers for space applications 
  Issued on: 2024-4-25   Price(USD): 315.0
GB/T 43538-2023 Quality and technical requirements for metal packages used for integrated circuits 
  Issued on: 2023-12-28   Price(USD): 495.0
GB/T 43536.1-2023 Three dimensional integrated circuit—Part 1：Terminologies and definitions 
  Issued on: 2023-12-28   Price(USD): 260.0
GB/Z 43510-2023 Integrated circuit TSV 3D package reliability test methods guideline 
  Issued on: 2023-12-28   Price(USD): 165.0
GB/T 43040-2023 Semiconductor integrated circuits—Test method of AC/DC converters  
  Issued on: 2023-09-07   Price(USD): 700.0
GB/T 43061-2023 Semiconductor integrated circuits—Test methods of PWM controller  
  Issued on: 2023-09-07   Price(USD): 1000.0
GB/T 43063-2023 Integrated circuit—Test method for CMOS image sensors 
  Issued on: 2023-9-7   Price(USD): 600.0
GB/T 43027-2023 Measuring methods of converter modules for high voltage input power supplie 
  Issued on: 2023-9-7   Price(USD): 1000.0
GB/T 42972-2023 Microwave circuits—Test methods for detector 
  Issued on: 2023-9-7   Price(USD): 400.0
GB/T 15879.604-2023 Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA) 
  Issued on: 2023-05-23   Price(USD): 285.0
GB/T 42706.1-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 1：General 
  Issued on: 2023-05-23   Price(USD): 465.0
GB/T 41852-2022 Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures 
  Issued on: 2022-10-12   Price(USD): 225.0
GB/T 41853-2022 Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement 
  Issued on: 2022-10-12   Price(USD): 315.0
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