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Position: Chinese Standard in English/DB32/T 4093-2021
DB32/T 4093-2021   Additive manufacturing-Pore defects testing for metal parts-Industrial computed tomography (CT) method (English Version)
Standard No.: DB32/T 4093-2021 Status:valid remind me the status change

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Target Language:English File Format:PDF
Word Count: 8500 words Translation Price(USD):255.0 remind me the price change

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Implemented on:2021-10-3 Delivery: via email in 1~3 business day

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Standard No.: DB32/T 4093-2021
English Name: Additive manufacturing-Pore defects testing for metal parts-Industrial computed tomography (CT) method
Chinese Name: 增材制造 金属制件孔隙缺陷检测 工业计算机层析成像(CT)法
Chinese Classification: H05    Structural element
Professional Classification: DB    Provincial Standard
Source Content Issued by: Jiangsu Adminstration of Market Regulation
Issued on: 2021-09-03
Implemented on: 2021-10-3
Status: valid
Target Language: English
File Format: PDF
Word Count: 8500 words
Translation Price(USD): 255.0
Delivery: via email in 1~3 business day
本文件规定了用工业计算机层析成像(CT)法,检测增材制造金属制件中孔隙缺陷的一般要求、检测步骤、检测记录与报告。
本文件适用于使用能量范IN为200keV-10MeV的工业CT系统对增材制造金属制件中孔隙缺陷的检测。
Code of China
Standard
DB32/T 4093-2021  Additive manufacturing-Pore defects testing for metal parts-Industrial computed tomography (CT) method (English Version)
Standard No.DB32/T 4093-2021
Statusvalid
LanguageEnglish
File FormatPDF
Word Count8500 words
Price(USD)255.0
Implemented on2021-10-3
Deliveryvia email in 1~3 business day
Detail of DB32/T 4093-2021
Standard No.
DB32/T 4093-2021
English Name
Additive manufacturing-Pore defects testing for metal parts-Industrial computed tomography (CT) method
Chinese Name
增材制造 金属制件孔隙缺陷检测 工业计算机层析成像(CT)法
Chinese Classification
H05
Professional Classification
DB
ICS Classification
Issued by
Jiangsu Adminstration of Market Regulation
Issued on
2021-09-03
Implemented on
2021-10-3
Status
valid
Superseded by
Superseded on
Abolished on
Superseding
Language
English
File Format
PDF
Word Count
8500 words
Price(USD)
255.0
Keywords
DB32/T 4093-2021, DB32 4093-2021, DB32T 4093-2021, DB32/T4093-2021, DB32/T 4093, DB32/T4093, DB324093-2021, DB32 4093, DB324093, DB32T4093-2021, DB32T 4093, DB32T4093
Introduction of DB32/T 4093-2021
本文件规定了用工业计算机层析成像(CT)法,检测增材制造金属制件中孔隙缺陷的一般要求、检测步骤、检测记录与报告。
本文件适用于使用能量范IN为200keV-10MeV的工业CT系统对增材制造金属制件中孔隙缺陷的检测。
Contents of DB32/T 4093-2021
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Keywords:
DB32/T 4093-2021, DB32 4093-2021, DB32T 4093-2021, DB32/T4093-2021, DB32/T 4093, DB32/T4093, DB324093-2021, DB32 4093, DB324093, DB32T4093-2021, DB32T 4093, DB32T4093