1 General Provisions
1.0.1 This code was compiled to make the design of clean room design in electronic industry be advanced in technology, economic, suitable, safe, reliable, resource saving, energy consumption less, quality guaranteed and in accordance with the requirements of labor health and environmental protection.
1.0.2 This code is applicable for the clean room design in construction, extension and innovation electronic industry.
1.0.3 Electronic industry clean room design shall be in accordance with the production process for electronic products requiring clean environment and shall obligate conditions for the product production development or production process improvement in the future according to specific circumstances.
1.0.4 The electronic industry clean room design shall create necessary conditions for the construction and installation, debugging detection, safe operation, operation and maintenance.
1.0.5 in addition to this code, electronic industry clean room design still shall comply with those specified in the current relevant standards of the state.
2 Terms
2.0.1 Clean room
It refers to the room controlling the air suspension particle concentration. Its construction and application shall reduce the ingress, generation and detaining of particles indoor. The other relevant parameters indoor, such as temperature, humidity, pressure shall be controlled according to requirements.
2.0.2 Clean zone
It refers to the zone controlling air suspension particle concentration. Its construction and application shall reduce the ingress, generation and detaining of particles in the zone. The other relevant parameters in the zone, such as temperature, humidity and pressure shall be controlled according to requirements. And it may be open-type or close type.
2.0.3 Room for cleaning human body
It refers to the room which needing cleaning according to a certain procedures before the personnel enter the clean room (zone).
2.0.4 Room for cleaning material
It refers to the room which needs cleaning according to a certain procedures before the personnel enter the clean room (zone).
2.0.5 Partical size
It refers to the equivalent sphere diameter with that of the tested particles responding to the given particle dimension determinator. The equivalent optical diameter is adopted for the separation particle counting and light scattering apparatus.
2.0.6 Airborne particles
It refers to the solid and liquid particles with 0.1~5μm in size range for the airborne particles in the air for air cleanliness classification use.
2.0.7 Particle concentration
It refers to the number of airborne particles in the air per unit volume.
2.0.8 Cleanliness
It refers to the cleanliness degree according to the number of particles with a certain particle diameter for per volume of air.
2.0.9 As-built
It refers to the state when the facilities have already founded and all the powers are actuated however without production facility, material or personnel.
2.0.10 At-rest
It refers to the state when the facilities have already been built and the production facilities have been installed and are operating in the agreed state of owner and supplier, however without production personnel.
2.0.11 Operational
The facilities operate in prescribed state accompanied by specified personnel and is working under concerted conditions.
2.0.12 Air pattern
It refers to the form and distribution of indoor air flow.
2.0.13 Unidirectional airflow
It refers to the air flow along single direction in parallel flow form and in accordance with the wind speed on cross section. It includes the vertical unidirectional flow and horizontal unidirectional flow.
2.0.14 Non-unidirectional airflow
It refers to the air flow which is not in accordance with the unidirectional flow definition.
2.0.15 Mixed airflow
It refers to the combined air flow of unidirectional flow and non- unidirectional flow.
2.0.16 Clean working area
It refers to the area higher than the ground by 0.8~15 m (excluding the special technical requirement) in the clean room.
2.0.17 Airshower
It refers to the room which blow down and clean the particles on the personnel entering clean room and the particles attached on the material surface with high speed clean air flow.
2.0.18 Airlock
It refers to the buffer space of contamination air flow and pressure difference control installed in the exit and entrance of clean room, outside air lock or in the adjacent room.
2.0.19 Passbox
It refers to the opening which transmitting material and working instruments on the clean room barrier. The open of window sashes on both sides shall be carried out with interconnected control.
2.0.20 Clean working garment
It refers to the clean clothes prepared for the working personnel to control the generated particles to the minimum degree in terms of the quantity of dust.
2.0.21 (HEPA) high efficiency particulate air filter
It refers to the air filter with over 99.95% of the particle diameter efficiency of easy penetrating and less than 220 Pa in initial resistance under the rated air flow conditions.
2.0.22 (ULPA) ultra low penetration air filter
It refers to the air filter with over 99. 9995 % of the particle diameter efficiency of easy penetrating and less than 250 Pa in initial resistance under the rated air flow conditions.
2.0.23 Minienvironment
It refers to the isolated space which separates the product production process from the operating staff and pollutants strictly.
2.0.24 Fan filter unit (FFU)
It refers to the device which is combined by the HEPA or ULPA and fans, constituting air cleaning at the end air cleaning which may be self powered.
2.0.25 Cleanliness recovery characteristic
It refers to the time required for the cleaning air conditioning system from initial operation to specify indoor cleanliness grade after the clean room is contaminated.
2.0.26 Technical mezzanine
It refers to the mezzanine separated with horizontal members, which is used for accessory equipment, public power facilities and pipeline installations.
2.0.27 Technical tunnel
It refers to the corridor separated with vertical members, which is used for accessory equipment, public power facilities and pipeline installations.
2.0.28 Technical shaft
It refers to the shaft-type corridor separated with vertical members, which is used for accessory equipment, public power facilities and pipeline installations.
2.0.29 Fire-firing access
It refers to the exclusive entrance for the fire fighters to enter the building to extinguish a fire, which is closed at original times and opened by the fire fighter s when applied.
2.0.30 Pure water
It refers to the water with little impurity content and the electrolyte impurity content (usually represented with resistivity) and non-electrolyte impurity (such as fine particles, organic materials, bacteria and dissolved gas and so on) content requires little water.
2.0.31 Bulk gas
It refers to the extensively used hydrogen gas, oxygen, nitrogen, argon gas, helium gas and other gases.
2.0.32 Special gas
It refers to the silicohydrides, phosphine, diborane, arsine, silicon tetrachloride, chlorine and other gases used during production process of electronic products. These gases are inflammable, toxic, corrosive or suffocating.
2.0.33 Chemical
It refers to the acid, alkali, organic solvent and oxide compound used during production process of electronic products.
2.0.34 ESD controlled environment
It refers to the specific environment which may prevent electrostatic hazard; under such environment, the static electricity is hard to generate or it is easy to release or eliminate when the static electricity is generated and the static noise is hard to transmit.
2.0.35 Surface resistance
It refers to the number obtained by dividing the loaded direct voltage between two eletrodes by the steady state current flowing between two eletrodes on the material surface.
3 Design Requirements for Production Environment of Electronic Products
3.1 General Requirements
3.1.1 The production environment for clean rooms in electronic industry shall be designed to control the fine particles and the harmful impurities for product quality according to the production process requirements; at the same time, the requirements of temperature, humidity, pressure difference, noise, vibration, static electricity protection, luminance and other parameters shall be made.
3.1.2 The production environment shall be designed to control the quality of all sorts of media, such as chemicals, bulk gases, special gases and pure water as required in the production process of electronic products according to the product variety and production process requirements.
3.1.3 The manufacturing material and cleaning manners for the tool, instrument and material storage and transportation devices used during the product production process in the clean room (zone) shall be selected according to the production process requirements.
3.1.4 The performance test and accreditation of air cleanliness and other items in the clean room (zone) shall be in accordance with those specified in Appendix D of this code.
1 General Provisions
2 Terms
3 Design Requirements for Production Environment of Electronic Products
3.1 General Requirements
3.2 Design Requirements for Production Environment
4 Overall Design
4.1 Site Selection and General Layout
4.2 Clean Room Type
4.3 Layout and Integrative Coordination of Clean Rooms
5 Process Design
5.1 General Requirements
5.2 Process Layout
5.3 Cleaning Human Body
5.4 Material Cleaning
5.5 Equipments and Working Instruments
6 Clean Architectural Design
6.1 General Requirements
6.2 Fire Prevention and Evacuation
6.3 Interior Decoration
7 Air Cleaning and Ventilation Design of Air Conditioner
7.1 General Requirements
7.2 Air Pattern and Air Output
7.3 Cleaning Air Conditioning System
7.4 Air cleaning facilities
7.5 Space Heating and Ventilating
7.6 Smoke Discharge
7.7 Air Pipes and Accessories
8 Water Supply and Drainage Design
8.1 General Requirements
8.2 Water Supply
8.3 Drainage
8.4 Rainwater
8.5 Fire Water Supply and Fire Fighting Equipment
9 Pure Water Supply
9.1 General Requirements
9.2 Pure water system
9.3 Tubes and Pipes, Valves and Accessories
10 Gas Supply
10.1 General Requirements
10.2 Bulk Gas System
10.3 Dry and Compressed Air System
10.4 Special Gas System
11 Chemical Supply
11.1 General Requirements
11.2 Chemical Storage and Transmission
11.3 Tubes and Pipes and Valves
12 Electrical Designs
12.1 Power Distribution
12.2 Illumination
12.3 Communication and Safety Protection System
12.4 Automatic Control
12.5 Grounding
13 Anti-static and Grounding Design
13.1 General Requirements
13.2 Anti-static Measures
13.3 Anti-static Grounding
14 Noise Control
14.1 General Requirements
14.2 Noise Control Design
15 Mini-vibration Control
15.1 General Requirements
15.2 Permissible Vibration Value
15.3 Mini-vibration Control Design
Appendix A Requirements of Air Cleanliness Class of Electronic Product Production
Appendix B Classified Examples of Fire Risk in the Electronic Product Production Room/Procedures
Appendix C Examples of Permissible Vibration Value of the Precision Instruments and Equipments
Appendix D Performance Test and Certification of Clean Room (zone)
Explanation of Wording in this Code
1 General Provisions
1.0.1 This code was compiled to make the design of clean room design in electronic industry be advanced in technology, economic, suitable, safe, reliable, resource saving, energy consumption less, quality guaranteed and in accordance with the requirements of labor health and environmental protection.
1.0.2 This code is applicable for the clean room design in construction, extension and innovation electronic industry.
1.0.3 Electronic industry clean room design shall be in accordance with the production process for electronic products requiring clean environment and shall obligate conditions for the product production development or production process improvement in the future according to specific circumstances.
1.0.4 The electronic industry clean room design shall create necessary conditions for the construction and installation, debugging detection, safe operation, operation and maintenance.
1.0.5 in addition to this code, electronic industry clean room design still shall comply with those specified in the current relevant standards of the state.
2 Terms
2.0.1 Clean room
It refers to the room controlling the air suspension particle concentration. Its construction and application shall reduce the ingress, generation and detaining of particles indoor. The other relevant parameters indoor, such as temperature, humidity, pressure shall be controlled according to requirements.
2.0.2 Clean zone
It refers to the zone controlling air suspension particle concentration. Its construction and application shall reduce the ingress, generation and detaining of particles in the zone. The other relevant parameters in the zone, such as temperature, humidity and pressure shall be controlled according to requirements. And it may be open-type or close type.
2.0.3 Room for cleaning human body
It refers to the room which needing cleaning according to a certain procedures before the personnel enter the clean room (zone).
2.0.4 Room for cleaning material
It refers to the room which needs cleaning according to a certain procedures before the personnel enter the clean room (zone).
2.0.5 Partical size
It refers to the equivalent sphere diameter with that of the tested particles responding to the given particle dimension determinator. The equivalent optical diameter is adopted for the separation particle counting and light scattering apparatus.
2.0.6 Airborne particles
It refers to the solid and liquid particles with 0.1~5μm in size range for the airborne particles in the air for air cleanliness classification use.
2.0.7 Particle concentration
It refers to the number of airborne particles in the air per unit volume.
2.0.8 Cleanliness
It refers to the cleanliness degree according to the number of particles with a certain particle diameter for per volume of air.
2.0.9 As-built
It refers to the state when the facilities have already founded and all the powers are actuated however without production facility, material or personnel.
2.0.10 At-rest
It refers to the state when the facilities have already been built and the production facilities have been installed and are operating in the agreed state of owner and supplier, however without production personnel.
2.0.11 Operational
The facilities operate in prescribed state accompanied by specified personnel and is working under concerted conditions.
2.0.12 Air pattern
It refers to the form and distribution of indoor air flow.
2.0.13 Unidirectional airflow
It refers to the air flow along single direction in parallel flow form and in accordance with the wind speed on cross section. It includes the vertical unidirectional flow and horizontal unidirectional flow.
2.0.14 Non-unidirectional airflow
It refers to the air flow which is not in accordance with the unidirectional flow definition.
2.0.15 Mixed airflow
It refers to the combined air flow of unidirectional flow and non- unidirectional flow.
2.0.16 Clean working area
It refers to the area higher than the ground by 0.8~15 m (excluding the special technical requirement) in the clean room.
2.0.17 Airshower
It refers to the room which blow down and clean the particles on the personnel entering clean room and the particles attached on the material surface with high speed clean air flow.
2.0.18 Airlock
It refers to the buffer space of contamination air flow and pressure difference control installed in the exit and entrance of clean room, outside air lock or in the adjacent room.
2.0.19 Passbox
It refers to the opening which transmitting material and working instruments on the clean room barrier. The open of window sashes on both sides shall be carried out with interconnected control.
2.0.20 Clean working garment
It refers to the clean clothes prepared for the working personnel to control the generated particles to the minimum degree in terms of the quantity of dust.
2.0.21 (HEPA) high efficiency particulate air filter
It refers to the air filter with over 99.95% of the particle diameter efficiency of easy penetrating and less than 220 Pa in initial resistance under the rated air flow conditions.
2.0.22 (ULPA) ultra low penetration air filter
It refers to the air filter with over 99. 9995 % of the particle diameter efficiency of easy penetrating and less than 250 Pa in initial resistance under the rated air flow conditions.
2.0.23 Minienvironment
It refers to the isolated space which separates the product production process from the operating staff and pollutants strictly.
2.0.24 Fan filter unit (FFU)
It refers to the device which is combined by the HEPA or ULPA and fans, constituting air cleaning at the end air cleaning which may be self powered.
2.0.25 Cleanliness recovery characteristic
It refers to the time required for the cleaning air conditioning system from initial operation to specify indoor cleanliness grade after the clean room is contaminated.
2.0.26 Technical mezzanine
It refers to the mezzanine separated with horizontal members, which is used for accessory equipment, public power facilities and pipeline installations.
2.0.27 Technical tunnel
It refers to the corridor separated with vertical members, which is used for accessory equipment, public power facilities and pipeline installations.
2.0.28 Technical shaft
It refers to the shaft-type corridor separated with vertical members, which is used for accessory equipment, public power facilities and pipeline installations.
2.0.29 Fire-firing access
It refers to the exclusive entrance for the fire fighters to enter the building to extinguish a fire, which is closed at original times and opened by the fire fighter s when applied.
2.0.30 Pure water
It refers to the water with little impurity content and the electrolyte impurity content (usually represented with resistivity) and non-electrolyte impurity (such as fine particles, organic materials, bacteria and dissolved gas and so on) content requires little water.
2.0.31 Bulk gas
It refers to the extensively used hydrogen gas, oxygen, nitrogen, argon gas, helium gas and other gases.
2.0.32 Special gas
It refers to the silicohydrides, phosphine, diborane, arsine, silicon tetrachloride, chlorine and other gases used during production process of electronic products. These gases are inflammable, toxic, corrosive or suffocating.
2.0.33 Chemical
It refers to the acid, alkali, organic solvent and oxide compound used during production process of electronic products.
2.0.34 ESD controlled environment
It refers to the specific environment which may prevent electrostatic hazard; under such environment, the static electricity is hard to generate or it is easy to release or eliminate when the static electricity is generated and the static noise is hard to transmit.
2.0.35 Surface resistance
It refers to the number obtained by dividing the loaded direct voltage between two eletrodes by the steady state current flowing between two eletrodes on the material surface.
3 Design Requirements for Production Environment of Electronic Products
3.1 General Requirements
3.1.1 The production environment for clean rooms in electronic industry shall be designed to control the fine particles and the harmful impurities for product quality according to the production process requirements; at the same time, the requirements of temperature, humidity, pressure difference, noise, vibration, static electricity protection, luminance and other parameters shall be made.
3.1.2 The production environment shall be designed to control the quality of all sorts of media, such as chemicals, bulk gases, special gases and pure water as required in the production process of electronic products according to the product variety and production process requirements.
3.1.3 The manufacturing material and cleaning manners for the tool, instrument and material storage and transportation devices used during the product production process in the clean room (zone) shall be selected according to the production process requirements.
3.1.4 The performance test and accreditation of air cleanliness and other items in the clean room (zone) shall be in accordance with those specified in Appendix D of this code.
Contents of GB 50472-2008
1 General Provisions
2 Terms
3 Design Requirements for Production Environment of Electronic Products
3.1 General Requirements
3.2 Design Requirements for Production Environment
4 Overall Design
4.1 Site Selection and General Layout
4.2 Clean Room Type
4.3 Layout and Integrative Coordination of Clean Rooms
5 Process Design
5.1 General Requirements
5.2 Process Layout
5.3 Cleaning Human Body
5.4 Material Cleaning
5.5 Equipments and Working Instruments
6 Clean Architectural Design
6.1 General Requirements
6.2 Fire Prevention and Evacuation
6.3 Interior Decoration
7 Air Cleaning and Ventilation Design of Air Conditioner
7.1 General Requirements
7.2 Air Pattern and Air Output
7.3 Cleaning Air Conditioning System
7.4 Air cleaning facilities
7.5 Space Heating and Ventilating
7.6 Smoke Discharge
7.7 Air Pipes and Accessories
8 Water Supply and Drainage Design
8.1 General Requirements
8.2 Water Supply
8.3 Drainage
8.4 Rainwater
8.5 Fire Water Supply and Fire Fighting Equipment
9 Pure Water Supply
9.1 General Requirements
9.2 Pure water system
9.3 Tubes and Pipes, Valves and Accessories
10 Gas Supply
10.1 General Requirements
10.2 Bulk Gas System
10.3 Dry and Compressed Air System
10.4 Special Gas System
11 Chemical Supply
11.1 General Requirements
11.2 Chemical Storage and Transmission
11.3 Tubes and Pipes and Valves
12 Electrical Designs
12.1 Power Distribution
12.2 Illumination
12.3 Communication and Safety Protection System
12.4 Automatic Control
12.5 Grounding
13 Anti-static and Grounding Design
13.1 General Requirements
13.2 Anti-static Measures
13.3 Anti-static Grounding
14 Noise Control
14.1 General Requirements
14.2 Noise Control Design
15 Mini-vibration Control
15.1 General Requirements
15.2 Permissible Vibration Value
15.3 Mini-vibration Control Design
Appendix A Requirements of Air Cleanliness Class of Electronic Product Production
Appendix B Classified Examples of Fire Risk in the Electronic Product Production Room/Procedures
Appendix C Examples of Permissible Vibration Value of the Precision Instruments and Equipments
Appendix D Performance Test and Certification of Clean Room (zone)
Explanation of Wording in this Code
