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| Position: Chinese Standard in English/GB/T 13062-2018 |
| GB/T 13062-2018 Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures (English Version) | |||
| Standard No.: | GB/T 13062-2018 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 7500 words | Translation Price(USD): | 220.0 remind me the price change |
| Implemented on: | 2019-7-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | GB/T 13062-2018 |
| English Name: | Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures |
| Chinese Name: | 半导体器件 集成电路 第21-1部分：膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序) |
| Chinese Classification: | L57 Film integrated circuit |
| Professional Classification: | GB National Standard |
| Source Content Issued by: | SAMR; SAC |
| Issued on: | 2018-12-28 |
| Implemented on: | 2019-7-1 |
| Status: | valid |
| Superseding: | GB/T 13062-1991 Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure |
| Target Language: | English |
| File Format: | |
| Word Count: | 7500 words |
| Translation Price(USD): | 220.0 |
| Delivery: | via email in 1~3 business day |