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| Position: Chinese Standard in English/GB/T 19247.6-2024 |
| GB/T 19247.6-2024 Printed board assemblies—Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (English Version) | |||
| Standard No.: | GB/T 19247.6-2024 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 19000 words | Translation Price(USD): | 570.0 remind me the price change |
| Implemented on: | 2024-7-1 | Delivery: | via email in 1~5 business day |
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| Standard No.: | GB/T 19247.6-2024 |
| English Name: | Printed board assemblies—Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method |
| Chinese Name: | 印制板组装 第6部分:球栅阵列（BGA）和盘栅阵列（LGA）焊点空洞的评估要求及测试方法 |
| Chinese Classification: | L30 Printed circuit |
| Professional Classification: | GB National Standard |
| Source Content Issued by: | SAMR; SAC |
| Issued on: | 2024-3-15 |
| Implemented on: | 2024-7-1 |
| Status: | valid |
| Target Language: | English |
| File Format: | |
| Word Count: | 19000 words |
| Translation Price(USD): | 570.0 |
| Delivery: | via email in 1~5 business day |