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Standard
| GB/T 34507-2017 Palladium coated copper bonding wire for semiconductor package (English Version) |
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Detail of GB/T 34507-2017
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Introduction of GB/T 34507-2017
本标准规定了半导体封装包括分立器件、集成电路、LED封装用镀钯铜丝的要求、试验方法、检验规则、标志、包装、运输、贮存、质量证明书、订货单（或合同）等内容。
本标准适用于半导体封装用镀钯铜丝。
Contents of GB/T 34507-2017