GB/T 6620-2009 English Version, GB/T 6620-2009 Test method for measuring warp on silicon slices by noncontact scanning (English Version)

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GB/T 6620-2009 Test method for measuring warp on silicon slices by noncontact scanning (English Version)
Standard No.:	GB/T 6620-2009	Status:	valid remind me the status change Email:
Target Language:	English	File Format:	PDF
Word Count:	6000 words	Translation Price(USD):	180.0 remind me the price change Email:
Implemented on:	2010-6-1	Delivery:	via email in 1~3 business day

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Standard No.:	GB/T 6620-2009
English Name:	Test method for measuring warp on silicon slices by noncontact scanning
Chinese Name:	硅片翘曲度非接触式测试方法
Chinese Classification:	H82 Elemental semiconductor material
Professional Classification:	GB National Standard
ICS Classification:	29.045 29.045 Semiconducting materials 29.045
Source Content Issued by:	AQSIQ; SAC
Issued on:	2009-10-30
Implemented on:	2010-6-1
Status:	valid
Superseding:	GB/T 6620-1995 Test method for measuring warp on silicon slices by noncontact scanning
Target Language:	English
File Format:	PDF
Word Count:	6000 words
Translation Price(USD):	180.0
Delivery:	via email in 1~3 business day

Standard

GB/T 6620-2009 Test method for measuring warp on silicon slices by noncontact scanning (English Version)
Standard No.	GB/T 6620-2009
Status	valid
Language	English
File Format	PDF
Word Count	6000 words
Price(USD)	180.0
Implemented on	2010-6-1
Delivery	via email in 1~3 business day

Detail of GB/T 6620-2009

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Introduction of GB/T 6620-2009

本标准规定了硅单晶切割片、研磨片、抛光片(以下简称硅片)翘曲度的非接触式测试方法。
本标准适用于测量直径大于50mm,厚度大于180μm 的圆形硅片。本标准也适用于测量其他半导体圆片的翘曲度。本测试方法的目的是用于来料验收或过程控制。本测试方法也适用于监视器件加工过程中硅片翘曲度的热化学效应。

Contents of GB/T 6620-2009

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Keywords:
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