GB/T 7581-2026 Dimensions of outlines for discrete semiconductor devices English, Anglais, Englisch, Inglés, えいご
This is a draft translation for reference among interesting stakeholders. The finalized translation (passing through draft translation, self-check, revision and verification) will be delivered upon being ordered.
ICS
CCS
National Standard of the People's Republic of China
GB/T 7581-2026
Replaces GB/T 7581-1987
Dimensions of outlines for discrete semiconductor devices
半导体分立器件外形尺寸
Issue date: 2026-03-31 Implementation date: 2026-10-01
Issued by the General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
the Standardization Administration of the People's Republic of China
Contents
Foreword
1 Scope
2 Normative References
3 Terms and Definitions
4 Package Outlines
4.1 Metal Packages
4.2 Plastic Packages
4.3 Ceramic Packages
4.4 Glass Packages
5 Dimensions and Tolerances
6 Package Outline Coding
6.1 General
6.2 Composition of Outline Code
7 Product Outline Drawings and Dimensional Parameters
7.1 General
7.2 Explanation of Dimension Symbols in Outline Drawings
7.3 Terminal Numbering in Outline Dimensions
7.4 Metal Package Dimensions
7.5 Plastic Package Dimensions
7.6 Ceramic Package Dimensions
7.7 Glass Package Dimensions
Semiconductor discrete devices — Dimensions
1 Scope
This document specifies the outline dimensions of semiconductor discrete devices.
This document applies to the package design of semiconductor discrete devices.
2 Normative References
The following documents are essential for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition (including any amendments) applies.
GB/T 1182 Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run out
GB/T 1804 General tolerances — Tolerances for linear and angular dimensions without individual tolerance indications
GB/T 15879.4-2019 Mechanical standardization of semiconductor devices — Part 4: Classification and coding system for semiconductor device package outlines
3 Terms and Definitions
No terms and definitions are defined in this document.
4 Package Outlines
4.1 Metal packages
The main types of metal packages are as follows:
a) Metal cylindrical package;
b) Metal flange mounting package;
c) Metal stud/bolt mounting package;
d) Metal rectangular package.
4.2 Plastic packages
The main types of plastic packages are as follows:
a) Plastic cylindrical package;
b) Plastic flange package;
c) Plastic stud/bolt package;
d) Plastic flat plate package;
e) Plastic in line package;
f) Plastic rectangular package;
g) Plastic disc/button package;
h) Plastic small outline package;
i) Plastic chip carrier package;
j) Plastic flat carrier package.
4.3 Ceramic packages
The main types of ceramic packages are as follows:
a) Ceramic chip carrier package;
b) Ceramic flat package.
4.4 Glass packages
The main types of glass packages are as follows:
a) Glass rectangular package;
b) Glass end seal package.
5 Dimensions and Tolerances
The outline dimensions specified in this document include all dimensions required for mechanical interchangeability of the devices.
The outline dimensions specified in this document are applicable to the finished device envelope or the device itself; therefore, manufacturing tolerances are not indicated. Only maximum and minimum limits or nominal dimensions together with the necessary geometrical tolerances are specified. For nominal dimensions without an indicated tolerance, the tolerances shall conform to the provisions of grade m in GB/T 1804.
The threads in this document are metric coarse threads for diameters of 12 mm or less, and metric fine threads for diameters greater than 12 mm.
Standard
GB/T 7581-2026 Dimensions of outlines for discrete semiconductor devices (English Version)
Standard No.
GB/T 7581-2026
Status
to be valid
Language
English
File Format
PDF
Word Count
63500 words
Price(USD)
1905.0
Implemented on
2026-10-1
Delivery
via email in 1~10 business day
Detail of GB/T 7581-2026
Standard No.
GB/T 7581-2026
English Name
Dimensions of outlines for discrete semiconductor devices
GB/T 7581-2026 Dimensions of outlines for discrete semiconductor devices English, Anglais, Englisch, Inglés, えいご
This is a draft translation for reference among interesting stakeholders. The finalized translation (passing through draft translation, self-check, revision and verification) will be delivered upon being ordered.
ICS
CCS
National Standard of the People's Republic of China
GB/T 7581-2026
Replaces GB/T 7581-1987
Dimensions of outlines for discrete semiconductor devices
半导体分立器件外形尺寸
Issue date: 2026-03-31 Implementation date: 2026-10-01
Issued by the General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
the Standardization Administration of the People's Republic of China
Contents
Foreword
1 Scope
2 Normative References
3 Terms and Definitions
4 Package Outlines
4.1 Metal Packages
4.2 Plastic Packages
4.3 Ceramic Packages
4.4 Glass Packages
5 Dimensions and Tolerances
6 Package Outline Coding
6.1 General
6.2 Composition of Outline Code
7 Product Outline Drawings and Dimensional Parameters
7.1 General
7.2 Explanation of Dimension Symbols in Outline Drawings
7.3 Terminal Numbering in Outline Dimensions
7.4 Metal Package Dimensions
7.5 Plastic Package Dimensions
7.6 Ceramic Package Dimensions
7.7 Glass Package Dimensions
Semiconductor discrete devices — Dimensions
1 Scope
This document specifies the outline dimensions of semiconductor discrete devices.
This document applies to the package design of semiconductor discrete devices.
2 Normative References
The following documents are essential for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition (including any amendments) applies.
GB/T 1182 Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run out
GB/T 1804 General tolerances — Tolerances for linear and angular dimensions without individual tolerance indications
GB/T 15879.4-2019 Mechanical standardization of semiconductor devices — Part 4: Classification and coding system for semiconductor device package outlines
3 Terms and Definitions
No terms and definitions are defined in this document.
4 Package Outlines
4.1 Metal packages
The main types of metal packages are as follows:
a) Metal cylindrical package;
b) Metal flange mounting package;
c) Metal stud/bolt mounting package;
d) Metal rectangular package.
4.2 Plastic packages
The main types of plastic packages are as follows:
a) Plastic cylindrical package;
b) Plastic flange package;
c) Plastic stud/bolt package;
d) Plastic flat plate package;
e) Plastic in line package;
f) Plastic rectangular package;
g) Plastic disc/button package;
h) Plastic small outline package;
i) Plastic chip carrier package;
j) Plastic flat carrier package.
4.3 Ceramic packages
The main types of ceramic packages are as follows:
a) Ceramic chip carrier package;
b) Ceramic flat package.
4.4 Glass packages
The main types of glass packages are as follows:
a) Glass rectangular package;
b) Glass end seal package.
5 Dimensions and Tolerances
The outline dimensions specified in this document include all dimensions required for mechanical interchangeability of the devices.
The outline dimensions specified in this document are applicable to the finished device envelope or the device itself; therefore, manufacturing tolerances are not indicated. Only maximum and minimum limits or nominal dimensions together with the necessary geometrical tolerances are specified. For nominal dimensions without an indicated tolerance, the tolerances shall conform to the provisions of grade m in GB/T 1804.
The threads in this document are metric coarse threads for diameters of 12 mm or less, and metric fine threads for diameters greater than 12 mm.
