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| Position: Chinese Standard in English/GB/T 8646-1998 |
| GB/T 8646-1998 Fine aluminum-1% silicon wire for semiconductor lend-bonding (English Version) | |||
| Standard No.: | GB/T 8646-1998 | Status: | superseded remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 3000 words | Translation Price(USD): | 264.0 remind me the price change |
| Implemented on: | 1999-2-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | GB/T 8646-1998 |
| English Name: | Fine aluminum-1% silicon wire for semiconductor lend-bonding |
| Chinese Name: | 半导体键合铝-1%硅细丝 |
| Chinese Classification: | H81 Semimetal |
| Professional Classification: | GB National Standard |
| ICS Classification: | 29.045 Semiconducting materials |
| Source Content Issued by: | State Qualtiy Technical Supervision Bureau |
| Issued on: | 1998-07-15 |
| Implemented on: | 1999-2-1 |
| Status: | superseded |
| Superseded by: | YS/T 543-2006 Fine aluminum-1% silicon wire for semiconductor lend-bonding |
| Superseded on: | 2006-10-11 |
| Abolished on: | 2007-09-29 |
| Superseding: | GB 8646-1988 |
| Target Language: | English |
| File Format: | |
| Word Count: | 3000 words |
| Translation Price(USD): | 264.0 |
| Delivery: | via email in 1~3 business day |