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| Position: Chinese Standard in English/JB/T 8175-1999 |
| JB/T 8175-1999 Outline dimensions of extruded heat sink for power semiconductor devices (English Version) | |||
| Standard No.: | JB/T 8175-1999 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 3000 words | Translation Price(USD): | 90.0 remind me the price change |
| Implemented on: | 2000-1-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | JB/T 8175-1999 |
| English Name: | Outline dimensions of extruded heat sink for power semiconductor devices |
| Chinese Name: | 电力半导体器件用型材散热体外形尺寸 |
| Chinese Classification: | K46 Power semiconductor device and parts |
| Professional Classification: | JB Professional Standard - Machinery |
| Source Content Issued by: | State Bureau of Machine Building Industry |
| Issued on: | 1999-8-6 |
| Implemented on: | 2000-1-1 |
| Status: | valid |
| Superseded by: | JB/T 5781-2025 Heat sinks for power semiconductors devices - Extruded heat sinks |
| Superseding: | JB/T 8175-1995 |
| Target Language: | English |
| File Format: | |
| Word Count: | 3000 words |
| Translation Price(USD): | 90.0 |
| Delivery: | via email in 1~3 business day |