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| Position: Chinese Standard in English/SJ/T 10454-2020 |
| SJ/T 10454-2020 Dielelectric paste for multilayer lay out of thick film hybrid integrated circuits (English Version) | |||
| Standard No.: | SJ/T 10454-2020 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 6000 words | Translation Price(USD): | 180.0 remind me the price change |
| Implemented on: | 2021-4-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | SJ/T 10454-2020 |
| English Name: | Dielelectric paste for multilayer lay out of thick film hybrid integrated circuits |
| Chinese Name: | 厚膜混合集成电路多层布线用介质浆料 |
| Professional Classification: | SJ Professional Standard - Electronics |
| Source Content Issued by: | MIIT |
| Issued on: | 2020-12-9 |
| Implemented on: | 2021-4-1 |
| Status: | valid |
| Superseding: | SJ/T 10454-1993 Dielectric paste for multilayer lay out of thick film hybrid integrated circuits |
| Target Language: | English |
| File Format: | |
| Word Count: | 6000 words |
| Translation Price(USD): | 180.0 |
| Delivery: | via email in 1~3 business day |