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Position: Chinese Standard in English/SJ/T 10455-1993
SJ/T 10455-1993   Copper conductor paste for thick film hybrid integrated circuits (English Version)
Standard No.: SJ/T 10455-1993 Status:superseded remind me the status change

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Target Language:English File Format:PDF
Word Count: 4000 words Translation Price(USD):120.0 remind me the price change

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Implemented on:1994-6-1 Delivery: via email in 1~3 business day

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,2021-4-1,1994-6-1,141137301531445B3E3A1CE11301B
Standard No.: SJ/T 10455-1993
English Name: Copper conductor paste for thick film hybrid integrated circuits
Chinese Name: 厚膜混合集成电路用铜导体浆料
Chinese Classification: A01    Technical Management
Professional Classification: SJ    Professional Standard - Electronics
Source Content Issued by: MIIT
Issued on: 1993-12-17
Implemented on: 1994-6-1
Status: superseded
Superseded by:SJ/T 10455-2020
Superseded on:2021-4-1
Target Language: English
File Format: PDF
Word Count: 4000 words
Translation Price(USD): 120.0
Delivery: via email in 1~3 business day
Code of China
Standard
SJ/T 10455-1993  Copper conductor paste for thick film hybrid integrated circuits (English Version)
Standard No.SJ/T 10455-1993
Statussuperseded
LanguageEnglish
File FormatPDF
Word Count4000 words
Price(USD)120.0
Implemented on1994-6-1
Deliveryvia email in 1~3 business day
Detail of SJ/T 10455-1993
Standard No.
SJ/T 10455-1993
English Name
Copper conductor paste for thick film hybrid integrated circuits
Chinese Name
厚膜混合集成电路用铜导体浆料
Chinese Classification
A01
Professional Classification
SJ
ICS Classification
Issued by
MIIT
Issued on
1993-12-17
Implemented on
1994-6-1
Status
superseded
Superseded by
SJ/T 10455-2020
Superseded on
2021-4-1
Abolished on
Superseding
Language
English
File Format
PDF
Word Count
4000 words
Price(USD)
120.0
Keywords
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Introduction of SJ/T 10455-1993
Contents of SJ/T 10455-1993
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