Standard No.:	SJ/T 11011-2015
English Name:	Test method for lead, bismuth, zinc, cadmium, iron, magnesium, aluminum, tin, antimony and phosphorus in pure silver brazing for electronic devices by ICP-AES
Chinese Name:	电子器件用纯银钎料中杂质含量 铅、铋、锌、镉、铁、镁、铝、锡、锑、磷的ICP-AES测试方法
Professional Classification:	SJ    Professional Standard - Electronics
Source Content Issued by:	Ministry of Industry and Information Technology
Issued on:	2015-10-10
Implemented on:	2016-4-1
Status:	valid
Superseding:	SJ/T 11011-1996 Method of analysis for pure silver brazing for electronic devices - Determination of lead (spectrophotometric-dithizone method) SJ/T 11017-1996 Methods of analysis for pure silver drazing fro electronic devices - Determination of phosphorus (spectrophotometric phosphomolybdate method) SJ/T 11013-1996 Methods of analysis for pure silver brazing for electronic devices - Determination of cadmium (spectrophotometric-atomic absorption method) SJ/T 11012-1996 Method of analysis for pure silver brazing for electronic devices - Determination of magnesium and zinc (spectrophotometric-atomic absorption method) SJ/T 11016-1996 Methods of analysis for pure silver brazing for electronic devices - Determination of bismuth (spectrophotometric strychnine-potasssium iodide method) SJ/T 11014-1996 Methods of analysis for pure silver brazing for electronic devices - Determination of antimony (spectrophotometric-malichite green method) SJ/T 11015-1996 Methods of analysis for pure silver brazing for electronic devices - Determination of iron (spectrophotometric-O-phenanthroline method)
Target Language:	English
File Format:	PDF
Word Count:	6000 words
Translation Price(USD):	194.0
Delivery:	via email in 1~3 business day

本标准规定了采用ICP-AES测定电子器件用纯银钎料中铅、铋、锌、镉、铁、镁、铝、锡、锑和磷的测试方法。本标准适用于电子器件用纯银钎料中铅、铋、锌、镉、铁、镁、铝、锡、锑和磷的测定。