Standard No.:	SJ/T 11104-2016
English Name:	Secification for electrodeposited gold coatings
Chinese Name:	金电镀层规范
Professional Classification:	SJ    Professional Standard - Electronics
Source Content Issued by:	Ministry of Industry and Information Technology
Issued on:	2016-06-01
Implemented on:	2016-6-1
Status:	valid
Superseding:	SJ/T 11104-1996 Metallic coatings-Electrodeposited gold and gold alloy coatings for engineering purposes SJ/T 11105-1996 Metallic coatings - Test mothods for electrodeposited gold and gold alloy coatings - Part 1: Determination of coating thickness SJ/T 11106-1996 Metallic coatings-Test methods for electrodeposited gold and gold alloy coatings-Part 2:Environmental tests SJ/T 11107-1996 Metallic coatings - Test methods for electrodeposited gold and gold alloy coatings - Part 3: Electrographic tests for porosity SJ/T SJ/T 11109-1996 Metallic coatings-Test methods for electrodeposited gold and gold alloy coatings-Part 5:Adhesion tests SJ/T 11108-1996 Metallic coatings - Test methods for electrodeposited gold and gold alloy coatings - Part 4: Determination of gold content
Target Language:	English
File Format:	PDF
Word Count:	7500 words
Translation Price(USD):	254.0
Delivery:	via email in 1~3 business day

本标准规定了金电镀层的性能指标要求和质量保证规定等内容。金镀层要求主要包括：材料、工艺和设备，基体材料，预处理，底镀层，后处理，及金镀层性能指标体系。金镀层性能指标主要包括：外观质量、厚度、结合力、硬度、耐热性、可焊性、残留盐、表面粗糙度、耐磨性、孔隙率、耐蚀性、电气性能、镀层成分等内容。