SJ/T 11273-2002 English Version, SJ/T 11273-2002 No-clean liquid soldering flux (English Version)

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SJ/T 11273-2002 No-clean liquid soldering flux (English Version)
Standard No.:	SJ/T 11273-2002	Status:	superseded remind me the status change Email:
Target Language:	English	File Format:	PDF
Word Count:	5000 words	Translation Price(USD):	150.0 remind me the price change Email:
Implemented on:	2003-3-1	Delivery:	via email in 1~3 business day

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Standard No.:	SJ/T 11273-2002
English Name:	No-clean liquid soldering flux
Chinese Name:	免清洗液态助焊剂
Chinese Classification:	L90 Special electronic technology material
Professional Classification:	SJ Professional Standard - Electronics
Source Content Issued by:	MIIT
Issued on:	2002-10-30
Implemented on:	2003-3-1
Status:	superseded
Superseded by:	SJ/T 11273-2016 No-clean liquid flux
Superseded on:	2016-9-1
Target Language:	English
File Format:	PDF
Word Count:	5000 words
Translation Price(USD):	150.0
Delivery:	via email in 1~3 business day

Standard

SJ/T 11273-2002 No-clean liquid soldering flux (English Version)
Standard No.	SJ/T 11273-2002
Status	superseded
Language	English
File Format	PDF
Word Count	5000 words
Price(USD)	150.0
Implemented on	2003-3-1
Delivery	via email in 1~3 business day

Detail of SJ/T 11273-2002

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Introduction of SJ/T 11273-2002

本标准规定了电子焊接用免清洗液态助焊剂的技术要求，试验方法、检验规则和产品的标志、包装、运输、贮存。本标准适用于印制板组装件及电气和电子电路接点锡焊用免清洗液态助焊剂。使用免清洗液态助焊剂时，对具有预涂保护层印制板组装的焊接，建议选用与其配套的预涂覆材料。

Contents of SJ/T 11273-2002

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