SJ/T 11742-2019 English Version, SJ/T 11742-2019 Thermal conductive semi-solidifying sheets of non-prepreg for printed circuits (English Version)

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SJ/T 11742-2019 Thermal conductive semi-solidifying sheets of non-prepreg for printed circuits (English Version)
Standard No.:	SJ/T 11742-2019	Status:	valid remind me the status change Email:
Target Language:	English	File Format:	PDF
Word Count:	9500 words	Translation Price(USD):	370.0 remind me the price change Email:
Implemented on:	2020-4-1	Delivery:	via email in 1~3 business day

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Standard No.:	SJ/T 11742-2019
English Name:	Thermal conductive semi-solidifying sheets of non-prepreg for printed circuits
Chinese Name:	印制电路用导热非预浸半固化片
Professional Classification:	SJ Professional Standard - Electronics
Source Content Issued by:	MIIT
Issued on:	2019-11-11
Implemented on:	2020-4-1
Status:	valid
Target Language:	English
File Format:	PDF
Word Count:	9500 words
Translation Price(USD):	370.0
Delivery:	via email in 1~3 business day

Standard

SJ/T 11742-2019 Thermal conductive semi-solidifying sheets of non-prepreg for printed circuits (English Version)
Standard No.	SJ/T 11742-2019
Status	valid
Language	English
File Format	PDF
Word Count	9500 words
Price(USD)	370.0
Implemented on	2020-4-1
Delivery	via email in 1~3 business day

Detail of SJ/T 11742-2019

Standard No.

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Introduction of SJ/T 11742-2019

本标准规定了印制电路用导热非预浸环氧树脂半固化片的分类、技术要求、检验规则、检验方法、包装、标志、运输和储存要求。本标准适用于金属基覆铜箔层压板中铜箔与金属基板之间绝缘粘结用导热胶膜(热导率范围1.0W/ m?K～3.0W/m?K),也可用于多层印制板层间粘结用导热胶膜。

Contents of SJ/T 11742-2019

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