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| SJ/T 11993-2025 Testing method for the pad cratering of printed circuit board assembly (English Version) |
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Introduction of SJ/T 11993-2025
本文件规定了印制电路板组件焊盘坑裂的测试步骤、结果表述、测试报告等方面的要求。
本文件适用于刚性印制电路板及组件焊盘抗坑裂强度评估测试。
Contents of SJ/T 11993-2025