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Position: Chinese Standard in English/SJ/T 2709-2016
SJ/T 2709-2016   Methods of measurement for temperature of printed board assemblies (English Version)
Standard No.: SJ/T 2709-2016 Status:valid remind me the status change

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Target Language:English File Format:PDF
Word Count: 4500 words Translation Price(USD):143.0 remind me the price change

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Implemented on:2017-1-1 Delivery: via email in 1~3 business day

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Standard No.: SJ/T 2709-2016
English Name: Methods of measurement for temperature of printed board assemblies
Chinese Name: 印制板组装件温度测试方法
Professional Classification: SJ    Professional Standard - Electronics
Source Content Issued by: MIIT
Issued on: 2016-10-22
Implemented on: 2017-1-1
Status: valid
Superseding:SJ/T 2709-1986
SJ 2709-1986 Methods of measurement for temperature of printed board assemblies
Target Language: English
File Format: PDF
Word Count: 4500 words
Translation Price(USD): 143.0
Delivery: via email in 1~3 business day
本标准规定了印制板组装件温度测试的测试设备、测试条件、测试流程及测试数据处理。本标准适用于测试印制板组装件的环境温度、温度场、元器件表面温度。
Code of China
Standard
SJ/T 2709-2016  Methods of measurement for temperature of printed board assemblies (English Version)
Standard No.SJ/T 2709-2016
Statusvalid
LanguageEnglish
File FormatPDF
Word Count4500 words
Price(USD)143.0
Implemented on2017-1-1
Deliveryvia email in 1~3 business day
Detail of SJ/T 2709-2016
Standard No.
SJ/T 2709-2016
English Name
Methods of measurement for temperature of printed board assemblies
Chinese Name
印制板组装件温度测试方法
Chinese Classification
Professional Classification
SJ
ICS Classification
Issued by
MIIT
Issued on
2016-10-22
Implemented on
2017-1-1
Status
valid
Superseded by
Superseded on
Abolished on
Superseding
SJ/T 2709-1986
SJ 2709-1986 Methods of measurement for temperature of printed board assemblies
Language
English
File Format
PDF
Word Count
4500 words
Price(USD)
143.0
Keywords
SJ/T 2709-2016, SJ 2709-2016, SJT 2709-2016, SJ/T2709-2016, SJ/T 2709, SJ/T2709, SJ2709-2016, SJ 2709, SJ2709, SJT2709-2016, SJT 2709, SJT2709
Introduction of SJ/T 2709-2016
本标准规定了印制板组装件温度测试的测试设备、测试条件、测试流程及测试数据处理。本标准适用于测试印制板组装件的环境温度、温度场、元器件表面温度。
Contents of SJ/T 2709-2016
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Keywords:
SJ/T 2709-2016, SJ 2709-2016, SJT 2709-2016, SJ/T2709-2016, SJ/T 2709, SJ/T2709, SJ2709-2016, SJ 2709, SJ2709, SJT2709-2016, SJT 2709, SJT2709