Standard No.:	T/CAQI 451-2025
Chinese Name:	芯片封装尺寸公差
Professional Classification:	T/    Social Organization Standard
ICS Classification:	29.045 29.045    Semiconducting materials 29.045
Source Content Issued by:	China Association for Quality Inspection
Issued on:	2025-08-07
Implemented on:	2025-9-6
Status:	valid
Target Language:	English
File Format:	PDF

本文件规定了芯片封装尺寸公差的要求、试验方法等内容。
本文件适用于集成电路芯片双列直插封装（DIP）、小外形封装（SOP）。