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| T/CASME 1853-2024 Laser cutting machines for semiconductor wafer processing (English Version) |
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Introduction of T/CASME 1853-2024
本文件规定了半导体晶圆加工用激光切割机的设备构成、型号命名与主要参数、要求、试验方法、检验规则及标志、包装、运输和贮存。
本文件适用于半导体晶圆加工用激光切割机的设计和制造。
Contents of T/CASME 1853-2024