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| Position: Chinese Standard in English/T/CEMIA 038-2023 |
| T/CEMIA 038-2023 Low temperature curable encapsulation paste for chip resistors (English Version) | |||
| Standard No.: | T/CEMIA 038-2023 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 7500 words | Translation Price(USD): | 225.0 remind me the price change |
| Implemented on: | 2023-12-30 | Delivery: | via email in 1~3 business day |
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| Standard No.: | T/CEMIA 038-2023 |
| English Name: | Low temperature curable encapsulation paste for chip resistors |
| Chinese Name: | 片式电阻器用低温固化包封浆料 |
| Chinese Classification: | L90 Special electronic technology material |
| Professional Classification: | T/ Social Organization Standard |
| Source Content Issued by: | CEMIA |
| Issued on: | 2023-11-14 |
| Implemented on: | 2023-12-30 |
| Status: | valid |
| Target Language: | English |
| File Format: | |
| Word Count: | 7500 words |
| Translation Price(USD): | 225.0 |
| Delivery: | via email in 1~3 business day |