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Detail of T/CWAN 0031-2021
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Introduction of T/CWAN 0031-2021
本文件规定了软钎焊膏的试验方法，包括合金化学成分、合金粉末形状、尺寸及分布、合金粉末及软钎剂的含量、焊膏稳定性、粘度、粘附性、塌陷试验、锡珠试验、润湿性、扩展率、铜腐蚀试验、铜镜试验、表面绝缘电阻、电化学迁移试验、存储寿命测试、干燥度（胶粘性）。
本文件适用于电子产品焊接用软钎焊膏。
Contents of T/CWAN 0031-2021