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| Chinese National Standard Category: Printed circuit |
| English Title: | Printed board assemblies—Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method |
| Chinese Title: | 印制板组装 第6部分:球栅阵列（BGA）和盘栅阵列（LGA）焊点空洞的评估要求及测试方法 |
| Standard No.: | GB/T 19247.6-2024 |
| Category No.: | L30 |
| Issued by: | SAMR; SAC |
| Issued on: | 2024-3-15 |
| Implemented on: | 2024-7-1 |
| Status: | valid |
| Superseded by: | |
| Superseded on: | |
| Abolished on: | |
| Superseding: | |
| Word Count: | 19000 words |
| Similar Standards: | GB/T 33772.3-2025 GB/T 19405.4-2025 GB/T 46696-2025 GB/T 46821-2025 GB/T 45723-2025 GB/T 45714.54-2025 GB/T 33772.2-2025 GB/T 19405.3-2025 GB/T 45713.4-2025 GB/T 45660-2025 GB/T 44295-2024 T/CPCA 014-2024 GB/T 43863-2024 GB/T 43799-2024 GB/T 43801-2024 GB/T 19247.6-2024 T/CPCA 013-2024 T/CPCA 011-2023 T/CPCA 010-2023 T/CPCA 007-2022 |
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