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| Position: Chinese Standard in English/GB/T 14112-2015 |
| GB/T 14112-2015 Semiconductor integrated circuits―Specification for stamped leadframes of plastic DIP (English Version) | |||
| Standard No.: | GB/T 14112-2015 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 12500 words | Translation Price(USD): | 370.0 remind me the price change |
| Implemented on: | 2016-1-1 | Delivery: | via email in 1~5 business day |
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| Standard No.: | GB/T 14112-2015 |
| English Name: | Semiconductor integrated circuits―Specification for stamped leadframes of plastic DIP |
| Chinese Name: | 半导体集成电路 塑料双列封装冲制型引线框架规范 |
| Chinese Classification: | L56 Semiconductor integrated circuit |
| Professional Classification: | GB National Standard |
| Source Content Issued by: | AQSIQ; SAC |
| Issued on: | 2015-05-15 |
| Implemented on: | 2016-1-1 |
| Status: | valid |
| Superseding: | GB/T 14112-1993 Semiconductor integrated circuits－Specification for stamped leadframes of plastic DIP |
| Target Language: | English |
| File Format: | |
| Word Count: | 12500 words |
| Translation Price(USD): | 370.0 |
| Delivery: | via email in 1~5 business day |