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| Position: Chinese Standard in English/GB/T 14112-1993 |
| GB/T 14112-1993 Semiconductor integrated circuits－Specification for stamped leadframes of plastic DIP (English Version) | |||
| Standard No.: | GB/T 14112-1993 | Status: | superseded remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 9000 words | Translation Price(USD): | 270.0 remind me the price change |
| Implemented on: | 1993-8-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | GB/T 14112-1993 |
| English Name: | Semiconductor integrated circuits－Specification for stamped leadframes of plastic DIP |
| Chinese Name: | 半导体集成电路 塑料双列封装冲制型引线框架规范 |
| Chinese Classification: | L55 Microcircuit in general |
| Professional Classification: | GB National Standard |
| Source Content Issued by: | State Technical Supervision Bureau |
| Issued on: | 1993-01-21 |
| Implemented on: | 1993-8-1 |
| Status: | superseded |
| Superseded by: | GB/T 14112-2015 Semiconductor integrated circuits―Specification for stamped leadframes of plastic DIP |
| Superseded on: | 2016-1-1 |
| Abolished on: | 2016-01-01 |
| Superseding: | SEMI G10-1986 |
| Target Language: | English |
| File Format: | |
| Word Count: | 9000 words |
| Translation Price(USD): | 270.0 |
| Delivery: | via email in 1~3 business day |