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| Position: Chinese Standard in English/GB/T 15879.5-2018 |
| GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuits (English Version) | |||
| Standard No.: | GB/T 15879.5-2018 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 18500 words | Translation Price(USD): | 550.0 remind me the price change |
| Implemented on: | 2019-4-1 | Delivery: | via email in 1~5 business day |
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| Standard No.: | GB/T 15879.5-2018 |
| English Name: | Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuits |
| Chinese Name: | 半导体器件的机械标准化 第5部分：用于集成电路载带自动焊(TAB)的推荐值 |
| Chinese Classification: | L55 Microcircuit in general |
| Professional Classification: | GB National Standard |
| Source Content Issued by: | SAMR; SAC |
| Issued on: | 2018-09-17 |
| Implemented on: | 2019-4-1 |
| Status: | valid |
| Superseding: | GB/T 15879-1995 Mechanical standardization of semiconductor devices Part 5: Recommendation applying to tape automated bonding (TAB) of integrated circuits |
| Target Language: | English |
| File Format: | |
| Word Count: | 18500 words |
| Translation Price(USD): | 550.0 |
| Delivery: | via email in 1~5 business day |