Standard No.:	GB/T 28277-2012
English Name:	Silicon-based MEMS fabrication technology—Measurement method of cutting and pull-press strength of micro bonding area
Chinese Name:	硅基MEMS制造技术 微键合区剪切和拉压强度检测方法
Chinese Classification:	L55    Microcircuit in general
Professional Classification:	GB    National Standard
Source Content Issued by:	AQSIQ;SAC
Issued on:	2012-5-11
Implemented on:	2012-12-1
Status:	valid
Target Language:	English
File Format:	PDF
Word Count:	11000 words
Translation Price(USD):	330.0
Delivery:	via email in 1~3 business day

本标准规定了硅基MEMS加工过程中所涉及的微小键合区域键合强度检测的要求和试验方法。
本标准适用于采用微电子工艺及相关微细加工技术制造的微小键合区的剪切和拉压强度测试。