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Position: Chinese Standard in English/GB/T 4058-1995
GB/T 4058-1995   Test method for detection of oxidation induced defects in polished silicon wafers (English Version)
Standard No.: GB/T 4058-1995 Status:superseded remind me the status change

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Target Language:English File Format:PDF
Word Count: 5000 words Translation Price(USD):340.0 remind me the price change

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Implemented on:1995-1-2 Delivery: via email in 1~3 business day

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2010-06-01 ,2010-6-1,1995-1-2,069990B459B955461513905553490
Standard No.: GB/T 4058-1995
English Name: Test method for detection of oxidation induced defects in polished silicon wafers
Chinese Name: 硅抛光片氧化诱生缺陷的检验方法
Chinese Classification: H26    Metal nondestructive testing method
Professional Classification: GB    National Standard
ICS Classification: 77.040.30 77.040.30    Chemical analysis of metals 77.040.30
Source Content Issued by: China State Bureau of Technical Supervision
Issued on: 1995-04-18
Implemented on: 1995-1-2
Status: superseded
Superseded by:GB/T 4058-2009 Test method for detection of oxidation induced defects in polished silicon wafers
Superseded on:2010-6-1
Abolished on:2010-06-01
Superseding:GB 4058-1983 Single crystal silicon--Detection of microdefects--Hot oxidation-etching technique
GB 6622-1986 Detects of swirls and striations in chemically polished silicon wafers
GB 6623-1986 Standard method for measuring the surface O. S. F of polished silicon wafers
Target Language: English
File Format: PDF
Word Count: 5000 words
Translation Price(USD): 340.0
Delivery: via email in 1~3 business day
本标准规定了硅抛光片氧化诱生缺陷的检验方法。本标准适用于硅抛光片表面区在模拟器件氧化工艺中诱生或增强的晶体缺陷的检测。
Code of China
Standard
GB/T 4058-1995  Test method for detection of oxidation induced defects in polished silicon wafers (English Version)
Standard No.GB/T 4058-1995
Statussuperseded
LanguageEnglish
File FormatPDF
Word Count5000 words
Price(USD)340.0
Implemented on1995-1-2
Deliveryvia email in 1~3 business day
Detail of GB/T 4058-1995
Standard No.
GB/T 4058-1995
English Name
Test method for detection of oxidation induced defects in polished silicon wafers
Chinese Name
硅抛光片氧化诱生缺陷的检验方法
Chinese Classification
H26
Professional Classification
GB
ICS Classification
Issued by
China State Bureau of Technical Supervision
Issued on
1995-04-18
Implemented on
1995-1-2
Status
superseded
Superseded by
GB/T 4058-2009 Test method for detection of oxidation induced defects in polished silicon wafers
Superseded on
2010-6-1
Abolished on
2010-06-01
Superseding
GB 4058-1983 Single crystal silicon--Detection of microdefects--Hot oxidation-etching technique
GB 6622-1986 Detects of swirls and striations in chemically polished silicon wafers
GB 6623-1986 Standard method for measuring the surface O. S. F of polished silicon wafers
Language
English
File Format
PDF
Word Count
5000 words
Price(USD)
340.0
Keywords
GB/T 4058-1995, GB 4058-1995, GBT 4058-1995, GB/T4058-1995, GB/T 4058, GB/T4058, GB4058-1995, GB 4058, GB4058, GBT4058-1995, GBT 4058, GBT4058
Introduction of GB/T 4058-1995
本标准规定了硅抛光片氧化诱生缺陷的检验方法。本标准适用于硅抛光片表面区在模拟器件氧化工艺中诱生或增强的晶体缺陷的检测。
Contents of GB/T 4058-1995
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Keywords:
GB/T 4058-1995, GB 4058-1995, GBT 4058-1995, GB/T4058-1995, GB/T 4058, GB/T4058, GB4058-1995, GB 4058, GB4058, GBT4058-1995, GBT 4058, GBT4058