SJ/T 10455-2020 English Version, SJ/T 10455-2020 Copper conductor paste for thick film hybrid integrated circuits (English Version)

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SJ/T 10455-2020 Copper conductor paste for thick film hybrid integrated circuits (English Version)
Standard No.:	SJ/T 10455-2020	Status:	valid remind me the status change Email:
Target Language:	English	File Format:	PDF
Word Count:	7000 words	Translation Price(USD):	210.0 remind me the price change Email:
Implemented on:	2021-4-1	Delivery:	via email in 1~3 business day

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Standard No.:	SJ/T 10455-2020
English Name:	Copper conductor paste for thick film hybrid integrated circuits
Chinese Name:	厚膜混合集成电路用铜导体浆料
Professional Classification:	SJ Professional Standard - Electronics
Source Content Issued by:	MIIT
Issued on:	2020-12-9
Implemented on:	2021-4-1
Status:	valid
Superseding:	SJ/T 10455-1993 Copper conductor paste for thick film hybrid integrated circuits
Target Language:	English
File Format:	PDF
Word Count:	7000 words
Translation Price(USD):	210.0
Delivery:	via email in 1~3 business day

Standard

SJ/T 10455-2020 Copper conductor paste for thick film hybrid integrated circuits (English Version)
Standard No.	SJ/T 10455-2020
Status	valid
Language	English
File Format	PDF
Word Count	7000 words
Price(USD)	210.0
Implemented on	2021-4-1
Delivery	via email in 1~3 business day

Detail of SJ/T 10455-2020

Standard No.

English Name

Chinese Name

Chinese Classification

Professional Classification

ICS Classification

Issued by

Issued on

Implemented on

Status

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Superseded on

Abolished on

Superseding

Language

File Format

Word Count

Price(USD)

Keywords

Introduction of SJ/T 10455-2020

本标准规定了厚膜混合集成电路用铜导体浆料的技术要求、试验方法、检验规则、包装、贮存及运输，适用于厚膜混合集成电路用铜导体浆料。

Contents of SJ/T 10455-2020

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