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| Position: Chinese Standard in English/SJ/T 11200-1999 |
| SJ/T 11200-1999 Environmental testing - Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (English Version) | |||
| Standard No.: | SJ/T 11200-1999 | Status: | superseded remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 5500 words | Translation Price(USD): | 165.0 remind me the price change |
| Implemented on: | 1999-5-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | SJ/T 11200-1999 |
| English Name: | Environmental testing - Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices |
| Chinese Name: | 环境试验 第2部分：试验方法 试验Tｄ：表面组装元器件的可焊性、金属化层耐熔蚀性和耐焊接热 |
| Chinese Classification: | L04 Basic standards and general methods |
| Professional Classification: | SJ Professional Standard - Electronics |
| Source Content Issued by: | MIIT |
| Issued on: | 1999-2-2 |
| Implemented on: | 1999-5-1 |
| Status: | superseded |
| Superseded by: | SJ/T 11200-2016 |
| Superseded on: | 2016-9-1 |
| Target Language: | English |
| File Format: | |
| Word Count: | 5500 words |
| Translation Price(USD): | 165.0 |
| Delivery: | via email in 1~3 business day |