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| Position: Chinese Standard in English/SJ/T 11200-2016 |
| SJ/T 11200-2016 Environmental testing Part 2-58: Tests Test Td:Test methods for solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices(SMD) (English Version) | |||
| Standard No.: | SJ/T 11200-2016 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 12000 words | Translation Price(USD): | 364.0 remind me the price change |
| Implemented on: | 2016-9-1 | Delivery: | via email in 1~5 business day |
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| Standard No.: | SJ/T 11200-2016 |
| English Name: | Environmental testing Part 2-58: Tests Test Td:Test methods for solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices(SMD) |
| Chinese Name: | 环境试验 2-58部分：试验 试验Td：表面组装元器件可焊性、金属化层耐溶蚀性和耐焊接热的试验方法 |
| Professional Classification: | SJ Professional Standard - Electronics |
| Source Content Issued by: | Ministry of Industry and Information Technology |
| Issued on: | 2016-04-05 |
| Implemented on: | 2016-9-1 |
| Status: | valid |
| Superseding: | SJ/T 11200-1999 Environmental testing - Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices |
| Target Language: | English |
| File Format: | |
| Word Count: | 12000 words |
| Translation Price(USD): | 364.0 |
| Delivery: | via email in 1~5 business day |