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| Position: Chinese Standard in English/YS/T 543-2015 |
| YS/T 543-2015 Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding (English Version) | |||
| Standard No.: | YS/T 543-2015 | Status: | superseded remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 7500 words | Translation Price(USD): | 220.0 remind me the price change |
| Implemented on: | 2015-10-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | YS/T 543-2015 |
| English Name: | Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding |
| Chinese Name: | 半导体键合用铝-1%硅细丝 |
| Chinese Classification: | H61 Light metals and their alloys |
| Professional Classification: | YS Professional Standard - Non-ferrous Metal |
| ICS Classification: | 29.045 Semiconducting materials |
| Source Content Issued by: | Ministry of Industry and Information Technology |
| Issued on: | 2015-04-30 |
| Implemented on: | 2015-10-1 |
| Status: | superseded |
| Superseded by: | YS/T 543-2024 YS/T 543-2025 Aluminum-1% silicon filament for semiconductor bonding |
| Superseded on: | 2025-11-1 |
| Abolished on: | 2025-11-01 |
| Superseding: | YS/T 543-2006 Fine aluminum-1% silicon wire for semiconductor lend-bonding |
| Target Language: | English |
| File Format: | |
| Word Count: | 7500 words |
| Translation Price(USD): | 220.0 |
| Delivery: | via email in 1~3 business day |