2025-12-6 216.73.216.21
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Position: Chinese Standard in English/YS/T 543-2025
YS/T 543-2025   Aluminum-1% silicon filament for semiconductor bonding (English Version)
Standard No.: YS/T 543-2025 Status:valid remind me the status change

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Target Language:English File Format:PDF
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,,2025-11-1,1FB17E14FFA60AD71753420102309
Standard No.: YS/T 543-2025
English Name: Aluminum-1% silicon filament for semiconductor bonding
Chinese Name: 半导体键合用铝-1%硅细丝
Professional Classification: YS    Professional Standard - Non-ferrous Metal
Source Content Issued by: Ministry of Industry and Information Technology
Issued on: 2025-04-10
Implemented on: 2025-11-1
Status: valid
Superseding:YS/T 543-2015 Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding
Target Language: English
File Format: PDF
Code of China
Standard
YS/T 543-2025  Aluminum-1% silicon filament for semiconductor bonding (English Version)
Standard No.YS/T 543-2025
Statusvalid
LanguageEnglish
File FormatPDF
Word Count words
Price(USD)
Implemented on2025-11-1
Deliveryvia email in business day
Detail of YS/T 543-2025
Standard No.
YS/T 543-2025
English Name
Aluminum-1% silicon filament for semiconductor bonding
Chinese Name
半导体键合用铝-1%硅细丝
Chinese Classification
Professional Classification
YS
ICS Classification
Issued by
Ministry of Industry and Information Technology
Issued on
2025-04-10
Implemented on
2025-11-1
Status
valid
Superseded by
Superseded on
Abolished on
Superseding
YS/T 543-2015 Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding
Language
English
File Format
PDF
Word Count
words
Price(USD)
Keywords
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Introduction of YS/T 543-2025
Contents of YS/T 543-2025
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Keywords:
YS/T 543-2025, YS 543-2025, YST 543-2025, YS/T543-2025, YS/T 543, YS/T543, YS543-2025, YS 543, YS543, YST543-2025, YST 543, YST543