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Position: Chinese Standard in English/YS/T 606-2006
YS/T 606-2006   Curable silver conductive paste (English Version)
Standard No.: YS/T 606-2006 Status:superseded remind me the status change

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Target Language:English File Format:PDF
Word Count: 6000 words Translation Price(USD):180.0 remind me the price change

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Implemented on:2006-12-1 Delivery: via email in 1~3 business day

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,2024-7-1,2006-12-1,14113751251031EA00ECD3B745C70
Standard No.: YS/T 606-2006
English Name: Curable silver conductive paste
Chinese Name: 固化型银导体浆料
Chinese Classification: H68    Precious metals and their alloys
Professional Classification: YS    Professional Standard - Non-ferrous Metal
ICS Classification: 77.120.99 77.120.99    Other non-ferrous metals and their alloys 77.120.99
Source Content Issued by: CNMIA
Issued on: 2006-5-25
Implemented on: 2006-12-1
Status: superseded
Superseded by:YS/T 606-2023
Superseded on:2024-7-1
Target Language: English
File Format: PDF
Word Count: 6000 words
Translation Price(USD): 180.0
Delivery: via email in 1~3 business day
本标准规定了固化型银导体浆料的要求,试验方法,检验规则和标志,包装,储存及订货单内容等。本标准适用于膜片开关用银浆料,碳膜电位器端头用银浆料及银导电胶等低温固后化型银导体浆料。
Code of China
Standard
YS/T 606-2006  Curable silver conductive paste (English Version)
Standard No.YS/T 606-2006
Statussuperseded
LanguageEnglish
File FormatPDF
Word Count6000 words
Price(USD)180.0
Implemented on2006-12-1
Deliveryvia email in 1~3 business day
Detail of YS/T 606-2006
Standard No.
YS/T 606-2006
English Name
Curable silver conductive paste
Chinese Name
固化型银导体浆料
Chinese Classification
H68
Professional Classification
YS
ICS Classification
Issued by
CNMIA
Issued on
2006-5-25
Implemented on
2006-12-1
Status
superseded
Superseded by
YS/T 606-2023
Superseded on
2024-7-1
Abolished on
Superseding
Language
English
File Format
PDF
Word Count
6000 words
Price(USD)
180.0
Keywords
YS/T 606-2006, YS 606-2006, YST 606-2006, YS/T606-2006, YS/T 606, YS/T606, YS606-2006, YS 606, YS606, YST606-2006, YST 606, YST606
Introduction of YS/T 606-2006
本标准规定了固化型银导体浆料的要求,试验方法,检验规则和标志,包装,储存及订货单内容等。本标准适用于膜片开关用银浆料,碳膜电位器端头用银浆料及银导电胶等低温固后化型银导体浆料。
Contents of YS/T 606-2006
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Keywords:
YS/T 606-2006, YS 606-2006, YST 606-2006, YS/T606-2006, YS/T 606, YS/T606, YS606-2006, YS 606, YS606, YST606-2006, YST 606, YST606