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Standard
YS/T 606-2023 (English Version) |
Detail of YS/T 606-2023
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Introduction of YS/T 606-2023
本文件规定了固化型银导体浆料的分类和标记、技术要求、试验方法、检验规则和标志、包装、运输、贮存及随行文件、订货单内容等。
本文件适用于膜片开关用银导体浆料、碳膜电位器用银导体浆料及微电子封装用银导电胶等低温固化型银导体浆料。
Contents of YS/T 606-2023