Test method for measuring surface metal contamination on semiconductor wafers - Total reflection X-Ray fluorescence spectroscopy GB/T 24578-2024 - Chinese Category:GB/T 24578-2024

English Title:	Test method for measuring surface metal contamination on semiconductor wafers - Total reflection X-Ray fluorescence spectroscopy
Chinese Title:	半导体晶片表面金属沾污的测定全反射X射线荧光光谱法
Standard No.:	GB/T 24578-2024
Category No.:	H21
Issued by:	State Administration for Market Regulation; Standardization Administration of China
Issued on:	2024-11-27
Implemented on:	2025-2-1
Status:	valid
Superseded by:
Superseded on:
Abolished on:
Superseding:	GB/T 24578-2015 Test method for measuring surface metal contamination on silicon wafers by total reflection X-Ray fluorescence spectroscopy GB/T 34504-2017 Measurement method for surface metal contamination on sapphire polished substrate wafer
Word Count:	10500 words
Similar Standards:	GB/T 14847-2025 GB/T 46227-2025 GB/T 20831-2025 GB/T 5161-2025 GB/T 19444-2025 GB/T 6148-2025 GB/T 6147-2025 GB/T 41079.3-2024 GB/T 44558-2024 GB/T 44330-2024 GB/T 24578-2024 GB/T 43894.1-2024 GB/T 43315-2023 GB/T 43313-2023 T/ZSA 231-2024 GB/T 23365-2023 GB/T 43092-2023 GB/T 43093-2023 GB/T 43096-2023 GB/T 42907-2023

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